(in alphabetic order)
Abstract:
The PDC “A PCB DFM Checklist Helps You Pass a Design Review” examines the traditional Excel-based PCB release process—project identification, schematic compliance, fabrication, assembly, and testability checks—and the bottlenecks of manual measurements.
DFM software uses fabricator constraint profiles to automate spacing, solder-mask, and test-point validations, instantly flagging violations.
Continuously updated DFM and assembly profiles align with evolving manufacturing capabilities, streamlining approvals and focusing teams on critical project-specific concerns.
Course Outline:
Part 2: Introduction to DFM Tools (30 min)
Part 3: Modernizing the Checklist (30 min)
Part 4: Collaborative Review and Best Practices (30 min)
Trainer:
Paul CARPINE
Account Technology Manager
Siemens EDA
After graduating the “Politechnica” University of Timisoara (Romania), Paul CARPINDE started his career as SMT Process Engineer in Flex, more than 15 years ago. From 2009 he moved to Automotive Industry and worked for Forvia (Hella) as a NPI Engineer and later as a Prototyping Manager. Since 2016 he is living in Germany and developed his career in design for manufacturing and design for reliability, working for ZF and Marquardt Group. He joined Siemens EDA in 2022 bringing the practical experience in electronics manufacturing and design for manufacturing.
(in alphabetic order)
Keynote speaker:
Paul CARPINE
Account Technology Manager
Siemens EDA
Keynote presentation:
A PCB DFM Checklist Helps You Pass a Design Review
After graduating the “Politechnica” University of Timisoara (Romania), Paul CARPINDE started his career as SMT Process Engineer in Flex, more than 15 years ago. From 2009 he moved to Automotive Industry and worked for Forvia (Hella) as a NPI Engineer and later as a Prototyping Manager. Since 2016 he is living in Germany and developed his career in design for manufacturing and design for reliability, working for ZF and Marquardt Group. He joined Siemens EDA in 2022 bringing the practical experience in electronics manufacturing and design for manufacturing.
Keynote speaker:
Martin METZLER
Senior Manager Technical Business
MacDermid Alpha Electronic Solutions
Keynote presentation:
Enabling Advanced Chiplet and SiP Architectures: Materials, Interconnects, and Thermal Solutions
Martin Metzler is Senior Manager for Technical Business Development. In this role, he leads a Europe-wide team and is responsible for technical business development across the region. He manages a diverse product portfolio within the Circuit Board Assembly and Semiconductor Assembly business areas, focusing on engaging with customers early on and integrating advanced materials and processes into future electronic applications.