Loading... (0%)

2016 IEEE 22nd Edition

Call for Papers - SIITME 2016

The organising committee of SIITME 2016 kindly invites you to submit an abstract/paper to the 2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging (SIITME). The scientific event will take place in Oradea, on October 20th–23rd, 2016.


Conference Committees