SIITME 2023 committee is proud to present confirmed
Keynote Speakers, Professional Development Courses and Industrial Invited Speakers:

PDC speaker:

Rajen Murugan
Engineering Manager, Multiphysics Modeling Team, TMG-SCP

Texas Instruments, Inc.

Professional Development Course:
”System-Level Predictive EMI/EMC Modeling – A Tutorial”

Dr. Rajen Murugan specializes in developing multiphysics simulation and modeling methodologies for advanced semiconductor IC packaging and systems. He is currently a Distinguished Member of the Technical Staff (DMTS) with Texas Instruments, Inc. He has 24 patents (68 pending) and has published over 75 papers in peer-reviewed IEEE journals and conferences.

PDC speaker:

Mark D. Poliks
Distinguished Professor of Materials Science and Engineering and Systems Science and Industrial Engineering

Thomas J. Watson College of Engineering and Applied Science, Binghamton University, State University of New York

Professional Development Course:
”Flexible and Hybrid Electronics – A Tutorial”

Mark D. Poliks is the founding director of the Center for Advanced Microelectronics Manufacturing (CAMM), a New York State Center of Advanced Technology and home to the New York Node of the federally supported NextFlex Manufacturing USA. Poliks has made sustained contributions to the fields of electronics packaging, flexible and hybrid electronics that are relevant to a variety of medical and industrial applications.

Keynote speaker:

Kemal Aygün
Distinguished INTEL Fellow

Intel Corporation

Keynote presentation:
”High Speed Signalling Challenges and Solutions for Electronic Packaging”

Kemal Aygün received the Ph.D. degree in electrical and computer engineering from the University of Illinois at Urbana-Champaign, Urbana, IL, USA, in 2002. In 2003, he joined the Intel Corporation, Chandler, AZ, USA, where he is currently an Intel Fellow and manages the High Speed I/O (HSIO) team in the Electrical Core Competency group. He has co-authored five book chapters, more than 90 journal and conference publications, and holds 84 U.S. patents. His research interests include novel technologies along with electrical modelling and characterization techniques for microelectronic packaging.

Keynote speaker:

Jonathan Church
Director of Product

Frenetic

Keynote presentation:
”The Journey of Optimization for Complex Magnetics”

After graduating from the University of Newcastle Upon Tyne with a BEng in Electrical & Electronic Engineering, Jonathan spent over a decade working with novel power converter applications for underwater vehicle systems. Working for numerous ROV (Remotely Operated Vehicle) manufacturers in the UK, he has been a key player for the industry in its transition from low frequency AC to high-frequency DC converter-based systems.

Keynote speaker:

Rajen Murugan
Engineering Manager

Texas Instruments, Inc.

Keynote presentation:
”Multiphysics Modeling of Semiconductor IC Packaging and Systems”

Dr. Rajen Murugan specializes in developing multiphysics simulation and modeling methodologies for advanced semiconductor IC packaging and systems. He is currently a Distinguished Member of the Technical Staff (DMTS) with Texas Instruments, Inc. He has 24 patents (68 pending) and has published over 75 papers in peer-reviewed IEEE journals and conferences.

Keynote speaker:

Mark D. Poliks
Distinguished Professor of Materials Science and Engineering and Systems Science and Industrial Engineering

Thomas J. Watson College of Engineering and Applied Science, Binghamton University, State University of New York

Keynote presentation:
”Electronics at the Edge: Flexible, Hybrid and Additive Approaches to Medical and Industrial Devices”

Mark D. Poliks is the founding director of the Center for Advanced Microelectronics Manufacturing (CAMM), a New York State Center of Advanced Technology and home to the New York Node of the federally supported NextFlex Manufacturing USA. Poliks has made sustained contributions to the fields of electronics packaging, flexible and hybrid electronics that are relevant to a variety of medical and industrial applications.

Industrial Invited speaker:

Nicolae Gross
Test engineer and hardware development engineer

Continental Automotive Systems

Presentation:
”Impact of package technology differences in power MOSFETs application”

Nicolae Gross –  50 years old, Electronic engineer,  graduated in 1996 the Technical University of Cluj-Napoca, Applied Electronics. He works in automotive industry, as test engineer and hardware development engineer, with more than 19 years experience. Since 2006 is employee of Continental Automotive Systems Sibiu. His activity was focused mostly on test equipment development, from concept definition to final assembly and delivery to the customer. He is in charge of coordinating a team of development engineers which develop not only the hardware equipment, but also the automation sequences for prototype testing and production line test equipment.

Industrial Invited speaker:

Călin Nemeș
Senior Hardware Design Engineer

Continental Automotive Systems Sibiu

Presentation:
”Virtual Prototyping Using Preliminary Data”

With a B.Sc. in Applied Electronics and an M.Sc. in Embedded Systems, Călin Nemeș has 14 years of design experience with sensor and communication interfaces for automotive safety systems. Combine this with lean design and organizational approaches, an active background in teaching and training and an interest in modeling analog and digital circuitry. His research interests include design and integration of hardware and software through electrical and behavioral modelling and simulation, over worst-case and failure conditions.