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Dear Colleagues,


The organising committee of SIITME 2020 kindly invites you to submit an abstract/paper to the 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME). The scientific event will be held as a virtual, live conference, on October 21st–24th, 2020.
This will ensure a high-quality conference to be held independent of what restrictions may apply in October 2020. The live format will allow interaction similar to an in-person conference. The digital format will give new possibilities, such as recording of presentations allowing to catch up presentations in parallel sessions.



Interested authors are invited to submit a two-page abstract according to the template, as MS-Word document and as PDF document, using the SIITME Conference Management System.

Papers meeting the quality criteria will be included in the IEEE Xplore Digital Library and Thomson-Reuters ISI-CPCI.
Abstracts and papers will be reviewed by the international Scientific Committee.

1.  Each abstract will be reviewed on:
– suitability for one of the topics of the conference
– scientific content and level, and the relevance of presented results;
– correspondence with the abstract template, English usage and grammar.

Authors of accepted abstracts will be invited to submit a full-length conference paper according to the conference paper template.
2.  Papers meeting the following criteria will be published in the Conference Proceedings and will be available through IEEE Xplore:
– the comments of the reviewers have been taken into consideration;
– originality of the paper[1] is given;
– it corresponds with the paper template, English usage and grammar are correct,
– signed IEEE copyright form has been submitted.



A. Emerging Topics in Advanced Packaging;
B. New Components and Manufacturing Technologies;
C. Printed Electronics, Smart Textiles and Healthcare;
D. Sensors, Actuators and Microsystems;
E. Nanomaterials, Nanoelectronics and Nanotechnology;
F. Embedded Systems, Robotics and Artificial Intelligence;
G. Power Electronics and Thermal Management;
H. Smart Grid and Renewable Energy;
I. Virtual Prototyping and System Validation;
J. Quality Management, Applied Reliability, Characterization and Testing Failure Diagnosis;
K. Corrosion in Electronics;
L. Challenges in Digitalisation and Global Education for Electronics.



Submission of abstracts : 31st of May 2020
Submission of abstracts [EXTENDED EXTRA]: 15th of July, 2020
Notification of abstract acceptance: 5th of August 2020
Submission of camera-ready papers and copyright forms: 10th of October 2020
Authors registration deadline: 10th of October 2020
Participants registration deadline: 10th of October 2020



General Chair:
Paul SVASTA, “Politehnica” University of Bucharest, Romania
General Academic Co-Chair:
Dan PITICĂ, Technical University of Cluj-Napoca, Romania
General Industrial Co-Chair:
Marian PETRESCU, Continental Automotive, Iaşi, Romania

Conference Chair:
Ioan LIŢĂ, University of Piteşti, Romania
Conference Co-Chair:
Cosmin MOISA, Continental Automotive, Timișoara, Romania

Technical Program Chair:
Detlef BONFERT, Fraunhofer EMFT, Münich, Germany
Technical Program Co-Chair:
Norocel CODREANU, “Politehnica” University of Bucharest, Romania

Awards Committee Chair:
Heinz WOHLRABE, Dresden University of Technology, Dresden, Germany

Scientific Committee Chair:
Balázs ILLÉS, Budapest University of Technology and Economics, Hungary
Scientific Co-Chairs:
Heinz WOHLRABE, Dresden University of Technology, Germany
Ciprian IONESCU, “Politehnica” University of Bucharest, Romania

Human Resource Education and Training Committee Chair:
Aurelia FLOREA, MIELE Tehnica, Braşov, Romania

Human Resource Education and Training Committee Co-Chair:
Maria MARCOVICI, Continental Automotive, Timisoara, Romania

Publication Chair:
Gabriel CHINDRIŞ, Technical University of Cluj- Napoca, Romania
Publication Co-Chair:
Bogdan MIHĂILESCU, “Politehnica” University of Bucharest, Romania

Professional Development Courses and International Publication Advisor:
Zsolt ILLYEFALVI-VITÉZ, Budapest University of Technology and Economics, Hungary

Virtual Conference Management Committee
Chair: Ioana MANEA, Cisco Romania
Co-Chairs: Alin DAVID, Cisco Romania
Robert DOBRE, University Politehnica of Bucharest, Romania



The conference fee includes full access to all online live conference sessions (workshops, industrial, oral and poster sessions) and digital conference proceedings.



WebEx Platform
ONLINE, Romania



Registration Officer Delia Lepădatu

Tel:       0040 213169633 / 0040 214024638
Fax:      0040 213169634
E-mail:    siitme@cetti.ro

Correspondence address:
Splaiul Independentei 313
06042, Bucharest, Romania

[1] The originality of papers will be checked by the iThenticate plagiarism detection and prevention software.