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A.   Emerging Technologies & Trends in Advanced Packaging 
–       Fine pitch and high lead count packaging in CSP, BGA, CGA, LGA or SMT packages
–       Advanced packaging involving new materials
–       Improved thermal management and new design, environmental protecting packaging
–       Innovative interconnects applied at advanced packaging
–       Organic printable electronics packaging
–       Green electronic packaging


B.   Power Electronics and Microsystems Packaging 
–       Alternative packaging and cooling concepts (e.g. double-sided cooling)
–       Thermal and thermo-mechanical performance of power packages and modules
–       Reliability investigations and life time prediction
–       High power and high temperature applications
–       New approach of sensor and actuator principles
–       Integration of new functionality in microsystems
–       Application and product-oriented packaging technologies: RF, MEMS and power packaging
–       Micro-nanointegration


C.   Assembly and Manufacturing Technology 
–       Advanced process development and equipment improvement for high volume production
–       Cost, yield, performance and environmental impact improvements
–       Process characterization
–       New product introduction and ramp-up
–       Design for flexible manufacturing, testing and burn-in, and design for manufacturing
–       Manufacturing simulation, optimization and scheduling
–       MEMS and optoelectronic assembly
–       Board level, product and system level assembly


D.   Electrical Design, Simulation & Modeling 
–       Technology-aware design of circuits and systems: from architectural design at implementation level
–       Multi domain system level modeling
–       Electrical, mechanical and thermal simulation and modeling
–       Prediction of thermal and mechanical performance of packages and modules
–       Simulation and characterization of packaging solutions including system-level applications
–       CAD – CAM Systems
–       Design for manufacturability and testability
–       Impact of integration technology – SiP and 3D


E.   Optoelectronics & Advanced Communication Packaging 
–       Power LED and solid state lighting
–       Optical communications
–       Optical PCB: optical and electrical signal integration
–       Hi-power diode laser packaging, couplings, fiber pigtailing and connectorization
–       Concentrating photovoltaics (CPV) and optoelectronics in energy
–       Wireless communications
–       RFID technology, tags and readers
–       Software Defined Radio


F.    Applied Reliability 
–       Fast reliability qualification, reliability standards
–       Advanced failure analysis, failure prediction and experimental verification
–       Reliability modeling, reliability diagnostics and curing
–       Reliability field data analysis
–       Characterization and modeling of the behavior of materials, processes and products
–       Lifetime prediction


G.   Challenge in Global Education 
–       Industry requirements for skills and competences needed of graduating engineers – now, and in the next 5-10 years
–       The impact of globalization on engineering practice and engineering education
–       The impact of progress in computing and networking on practice and education in engineering
–       The role of technology transfer and commercialization of research in Engineering Education.
–       Teaching non-technical skills to engineers: interpersonal, written and oral communications; cross-cultural awareness; language skills; entrepreneurship; environmental and ethical concerns; leadership; legal and regulatory requirements; managing intellectual property
–       Strategies for introducing and sustaining curricular reform in engineering
–       Strategies for introducing and sustaining cross-disciplinary academic programs
–       Providing lifelong learning to graduating engineers