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2018 IEEE 24th Edition

The organising committee of SIITME 2018 kindly invites you to submit an abstract/paper to the 2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging (SIITME). The scientific event will take place in Iași, Romania, on October 25th–28th, 2018.

Submission of abstracts/papers

Authors are invited to submit an abstract/paper to SIITME 2018 using the conference management system powered by Microsoft’s Academic Conference Management Service.