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2014 IEEE 20th Edition

Call for Papers

The organising committee of SIITME 2014 kindly invites you to submit an abstract/paper to the 2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging (SIITME). The scientific event will take place in Bucharest, on October 23rd–26th, 2014.

Download the Call for Papers – SIITME2014 (PDF)
Conference Committees

The conference will take place at:
Hotel Yesterday
Economu Cezărescu 8
Bucharest, Romania