The organising committee of SIITME 2023 kindly invites you to submit an abstract/paper to the 2023 IEEE 29th International Symposium for Design and Technology in Electronic Packaging (SIITME), organized in Craiova, Romania. The scientific event will be held on October 18th–20th, 2023.
SUBMISSION OF ABSTRACTS AND PAPERS
Interested authors are invited to submit a two-page abstract according to the template, as MS-Word document and as PDF document, using the SIITME Conference Management System.
Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements.
Abstracts and papers will be reviewed by the International Scientific Committee of SIITME.
1. Each abstract will be reviewed on:
– suitability for one of the topics of the conference
– scientific content and level, and the relevance of presented results;
– correspondence with the abstract template, English usage and grammar.
Authors of accepted abstracts will be invited to submit a full-length conference paper according to the conference paper template.
2. Papers meeting the following criteria will be published in the Conference Proceedings and will be available through IEEE Xplore:
– the comments of the reviewers have been taken into consideration;
– originality of the paper is given;
– it corresponds with the paper template, English usage and grammar are correct,
– signed IEEE copyright form has been submitted.
A. Emerging Topics in Advanced Packaging;
B. New Components and Manufacturing Technologies;
C. Printed Electronics, Smart Textiles and Healthcare;
D. Sensors, Actuators and Microsystems;
E. Nanomaterials, Nanoelectronics and Nanotechnology;
F. Embedded Systems, Robotics and Artificial Intelligence;
G. Power Electronics and Thermal Management;
H. Smart Grid and Renewable Energy;
I. Virtual Prototyping and System Validation;
J. Quality Management, Applied Reliability, Characterization and Testing Failure Diagnosis;
K. Corrosion in Electronics;
L. Challenges in Digitalisation and Global Education for Electronics.
|Submission of abstracts:||18th of June 2023|
|Notification of abstract acceptance:||9th of July 2023|
|Authors and participants registration EARLYBIRD deadline:||1st of August 2023|
|Submission of camera-ready papers:||24th of September 2023|
|Review of camera-ready papers:||8th of October 2023|
|Submission of modified camera-ready papers (post-review) and copyright forms:||15th of October 2023|
|Submission of SIITME 2023 presentations and video pitch:||15th of October 2023|
|Authors and participants registration deadline:||15th of October 2023|
Paul SVASTA, University Politehnica of Bucharest, Romania
Association for Promoting Electronics Technology
General Academic Co-Chair:
Dan PITICĂ, Technical University of Cluj-Napoca, Romania
General Industrial Co-Chair:
Cristian GAVRILESCU, Continental Automotive, Romania
Mircea Cătălin CONSTANTINESCU, University of Craiova, Romania
Cosmin MOISA, Continental Automotive, Timișoara, Romania
Technical Program Chair:
Detlef BONFERT, Fraunhofer EMFT, Münich, Germany
Technical Program Co-Chair:
Norocel CODREANU, “Politehnica” University of Bucharest, Romania
Awards Committee Chair:
Heinz WOHLRABE, Dresden University of Technology, Dresden, Germany
Ovidiu Aurel POP, Technical University of Cluj-Napoca, Romania
Scientific Committee Chair:
Balázs ILLÉS, Budapest University of Technology and Economics, Hungary
Heinz WOHLRABE, Dresden University of Technology, Germany
Ciprian IONESCU, “Politehnica” University of Bucharest, Romania
Exposition Committee Chair:
Rajmond JÁNÓ, Technical University of Cluj Napoca, Romania
Exposition Committee Co-Chairs:
Rodica CONSTANTINESCU, University Politehnica of Bucharest, Romania
Raul IONEL, Continental Automotive, Timișoara, Romania
Human Resource Education and Training Committee Chair:
Aurelia FLOREA, MIELE Tehnica, Braşov, Romania
Human Resource Education and Training Committee Co-Chair:
Bálint MEDGYES, Budapest University of Technology and Economics, Hungary
Human Resource Education and Training Committee Edition Chair:
Maria MARCOVICI, Continental Automotive, Timișoara, Romania
Gabriel CHINDRIŞ, Technical University of Cluj- Napoca, Romania
Bogdan MIHĂILESCU, “Politehnica” University of Bucharest, Romania
Professional Development Courses and International Publication Advisor:
Zsolt ILLYEFALVI-VITÉZ, Budapest University of Technology and Economics, Hungary
Social Media Committee Chair:
Monica CIOLACU, University of Passau, Germany
Social Media Committee Co-Chair:
Alina MARCU, University Politehnica of Bucharest, Romania
CONFERENCE REGISTRATION OPENS on 1st of July 2023
The conference fee includes full access to all conference sessions (workshops, industrial, oral and poster sessions) and digital conference proceedings.
Craiova, Romania | Please visit the VENUE information - available soon.
Delia Lepădatu 0040.720.093.945 0040.769.247.904
Tel: 0040 213169633 / 0040 214024638 Fax: 0040 213169634 E-mail: email@example.com https://www.siitme.ro Correspondence address: Splaiul Independentei 313 06042, Bucharest, Romania
 The originality of papers will be checked by the iThenticate plagiarism detection and prevention software.