Previous editions of SIITME provided the favorable framework for meeting and collaborating with industrial and academic partners, with the purpose of developing a permanent partnership to support the future progress of the electronic industry. The two key elements considered are technology and human resources.

In present, we know that the European strategy has as priority the promotion of economic growth: sustainable, intelligent, based on the knowledge and on putting them into practice through innovation and inclusion oriented – employment. (www.mae.ro)

We are pleased to see the constant concern and motivation of the SIITME participants for research and innovation. Topics approached such as robotics, artificial intelligence, virtual prototype, intelligent network, thermal management, assembly and manufacturing technology, etc. are the proof that industry is in a continuous and fast technological transformation.

With focus on digitization, automation and robotization, the objective of the economic environment targets the opportunity to develop the skills and abilities of the next generation: cognitive flexibility, overall vision, critical thinking, innovation, etc. Our challenge as an employer is to develop a framework in which the aforementioned topics are not single and scattered, but are part of a solid strategy.

Miele’s constant involvement and support encourages the delivery of research projects with high potential for implementation, which helps the company grow in the direction of continuous improvement.

A work environment that owns and offers access to state-of-the-art technology and where employees feel encouraged to experiment and exchange know-how generates innovation.

Miele is constantly involved and supports the academic environment in order to align the concept of education with the requirements of the industry.

Only through mutual support we can reach solutions, so that the future generation could have the possibility of developing a professional career in any industry.

Aurelia Florea

Human Resources and Procurement Director, Miele Brasov

12:00-12:20     Workshop opening, Strategic Partnership for Education

Dan PITICĂ, Ph.D., Vice-rector at Technical University of Cluj-Napoca

Aurelia FLOREA, HR Director Miele Romania and Working Group Coordinator – Industry and Academic Environment

Paul SVASTA, Ph.D., University Politehnica of Bucharest, Association for Promoting Electronics Technology

12:20-14:45    Presentation Session:  Relationship: Educational environment – Industrial environment – Concrete actions

Chairman: Dan PITICĂ, Ph.D., Vice-rector at Technical University of Cluj-Napoca

Co-chair: Cosmin MOISA – Head Of Department at Continental Automotive Romania

Strategic Partnership for Education worging group activities – folow-up 

Aurelia FLOREA, HR Director Miele Romania and Working Group Coordinator – Industry and Academic Environment

Holistic  Education

Importance of Academic and Industry Partnership – Good actions practices that contribute to the development of competences

Fabian HENZE, Agile Coach Miele Gutersloh, Germany

Q&A session

Debate related to the Holistic education Approach

Workshop participants

14:45-14:55     Summary and further actions

Aurelia FLOREA, HR Director Miele Romania and Working Group Coordinator – Industry and Academic Environment

Chairpersons of the meeting (Chapter founders, 1999):

Prof. Zsolt Illyefalvi-Vitez, Ph.D., Budapest University of Technology and Economics

Prof. Paul Svasta, Ph.D., University Politehnica of Bucharest, Association for Promoting Electronics Technology

Invited persons: 

Toni Mattila, Ph.D. – Connected Intelligent Industries Finland – IEEE-EPS Welcome

Cristian Negrescu, Ph.D.  – IEEE Romania Section Chair

Marian Petrescu, Ph.D.  – Continental Automotive Romania

Klaus-Jürgen Wolter Ph.D.  – Technical University of Dresden

Report regarding the IEEE-EPS Hu&Ro Joint Chapter activity

Ciprian Ionescu, Ph.D. – Chapter Chair

Strategic approach of the ESTC events

Toni Mattila, Ph.D. – IEEE-EPS Region 8 Director

Cooperation between NTC (Nanotechnology Council) and Hu&Ro EPS Chapter

Attila Bonyár, Ph.D., Budapest University of Technology and Economics

Hu&Ro Chapter officer election

Election Committee: Paul Svasta, Zsolt Illyefalvi-Vitez, Norocel Codreanu

In the past two decades thermal transient testing became common practice in thermal characterization of packaged semiconductor devices. The classical application is the identification of thermal metrics of packages such as junction-to-case or junction-to-ambient thermal resistance. The structure functions derived from measured thermal impedance curves offer much more than just identification of thermal metrics. The detailed structural information obtained about the junction to ambient heat-flow path allows e.g. qualification of die attach layers (detect voiding or delamination) which can be further exploited in reliability testing. Structure functions also help calibrate detailed 3D thermal models of device packages and derive compact thermal models as well. In case of LEDs, the real thermal resistance / impedance can be derived only if thermal and radiometric measurements are combined. The obtained test data also support modelling the multi-domain behavior of LED packages. This was exploited in the recently finished Delphi4LED H2020 ECSEL project of the EU, resulting in new, Industry 4.0 workflows of designing LED based luminaires. The topics covered by the course include:

• Overview of thermal testing standards used in package characterization, the basic principles of thermal transient testing
• Introduction to structure functions and their applications
• Issues of testing LED packages; isothermal IVL measurements
• Test based multi-domain modelling of LEDs; using LED multi-domain models in an Industry 4.0 compliant luminaire design flow
• Thermal transient testing combined with power cycling and LED life-time tests; new power cycling testing solutions for power semiconductor device packages

Prof. András Poppe, Ph.D., Head of the Department of Electron Devices
Budapest University of Technology and Economics