Dear Colleagues,

The organising committee of SIITME 2026 kindly invites you to submit an abstract/paper to the 2022 IEEE 32^nd International Symposium for Design and Technology in Electronic Packaging (SIITME), organized in Târgoviște, Romania. The scientific event will be held on October 28th–31st, 2026.

SUBMISSION OF ABSTRACTS AND PAPERS

Interested authors are invited to submit a two-page abstract according to the template, as MS-Word document and as PDF document, using the SIITME Conference Management System. The Microsoft CMT service was used for managing the peer-reviewing process for this conference. This service was provided for free by Microsoft and they bore all expenses, including costs for Azure cloud services as well as for software development and support.

Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements.

Abstracts and papers will be reviewed by the International Scientific Committee of SIITME.

1.  Each abstract will be reviewed on:
– suitability for one of the topics of the conference
– scientific content and level, and the relevance of presented results;
– correspondence with the abstract template, English usage and grammar.

Authors of accepted abstracts will be invited to submit a full-length conference paper according to the conference paper template.

2.  Papers meeting the following criteria will be published in the Conference Proceedings:
– the comments of the reviewers have been taken into consideration;
– originality of the paper[1] is given;
– it corresponds with the paper template, English usage and grammar are correct,
– signed IEEE copyright form has been submitted.

TOPICS

A. Emerging Topics in Advanced Packaging;
B. New Components and Manufacturing Technologies;
C. Printed Electronics, Smart Textiles and Healthcare;
D. Sensors, Actuators and Microsystems;
E. Nanomaterials, Nanoelectronics and Nanotechnology;
F. Embedded Systems, Robotics and Artificial Intelligence;
G. Power Electronics and Thermal Management;
H. Smart Grid and Renewable Energy;
I. Virtual Prototyping and System Validation;
J. Quality Management, Applied Reliability, Characterization and Testing Failure Diagnosis;
K. Corrosion in Electronics;
L. Challenges in Digitalisation and Global Education for Electronics.

IMPORTANT DATES

CHAIRS

General Chair:
Paul SVASTA, University Politehnica of Bucharest, Romania
Association for Promoting Electronics Technology
General Academic Co-Chair:
Dan PITICĂ, Technical University of Cluj-Napoca, Romania
General Industrial Co-Chair:
Cristian GAVRILESCU, Continental Automotive, Romania

Conference Chair:

Conference Co-Chair:

Technical Program Chair:
Detlef BONFERT, Fraunhofer EMFT, Münich, Germany
Technical Program Co-Chair:
Norocel CODREANU, “POLITEHNICA” University of Bucharest, Romania
Cristina MARGHESCU, “POLITEHNICA” University of Bucharest, Romania

Awards Committee Chair:
Heinz WOHLRABE, Dresden University of Technology, Dresden, Germany
Cristina MARGHESCU, “POLITEHNICA” University of Bucharest, Romania

Scientific Committee Chair:
Ciprian IONESCU, “POLITEHNICA” University of Bucharest, Romania
Scientific Co-Chairs:
Heinz WOHLRABE, Dresden University of Technology, Germany

Exposition Committee Chair:
Rajmond JÁNÓ, Technical University of Cluj Napoca, Romania
Exposition Committee Co-Chairs:
Adelina-Ioana ILIEȘ, Technical University of Cluj Napoca, Romania

Work Force Education and Training Committee Chair:
Aurelia FLOREA, MIELE Tehnica, Braşov, Romania
Work Force Education and Training Committee Co-Chairs:
Cristina MARGHESCU, “POLITEHNICA” University of Bucharest, Romania

Publication Chair:
Alexandra FODOR, Technical University of Cluj- Napoca, Romania
Publication Co-Chair:
Bogdan MIHĂILESCU, “POLITEHNICA” University of Bucharest, Romania

Professional Development Courses and International Publication Advisor:
Zsolt ILLYEFALVI-VITÉZ, Budapest University of Technology and Economics, Hungary

Social Media Committee Chair: 
Monica CIOLACU, University of Passau, Germany
Social Media Committee Co-Chair:
Alina MARCU, “POLITEHNICA” University of Bucharest, Romania

CONFERENCE REGISTRATION OPENS on 1st of July 2026

The conference fee includes full access to all conference sessions (workshops, industrial, oral and poster sessions) and digital conference proceedings.

LOCATION

Târgoviște, Romania | Please visit the VENUE webpage information from 1st June 2026

CONTACT INFORMATION:

Registration Officers

Delia Lepădatu
Cristina Bragadiru

0040.720.093.945
0040.769.247.904

Tel:      0040 213169633 / 0040 214024638
E-mail:   contact@siitme.ro
https://www.siitme.ro

Correspondence address:
Splaiul Independentei 313
06042, Bucharest, Romania