(in alphabetic order)
Keynote speaker:
Paul CARPINE
Account Technology Manager
Siemens EDA
Keynote presentation:
A PCB DFM Checklist Helps You Pass a Design Review
After graduating the “Politechnica” University of Timisoara (Romania), Paul CARPINDE started his career as SMT Process Engineer in Flex, more than 15 years ago. From 2009 he moved to Automotive Industry and worked for Forvia (Hella) as a NPI Engineer and later as a Prototyping Manager. Since 2016 he is living in Germany and developed his career in design for manufacturing and design for reliability, working for ZF and Marquardt Group. He joined Siemens EDA in 2022 bringing the practical experience in electronics manufacturing and design for manufacturing.
Keynote speaker:
Martin METZLER
Senior Manager Technical Business Development
MacDermid Alpha Electronic Solutions
Keynote presentation:
Enabling Advanced Chiplet and SiP Architectures: Materials, Interconnects, and Thermal Solutions
Martin Metzler is Senior Manager for Technical Business Development. In this role, he leads a Europe-wide team and is responsible for technical business development across the region. He manages a diverse product portfolio within the Circuit Board Assembly and Semiconductor Assembly business areas, focusing on engaging with customers early on and integrating advanced materials and processes into future electronic applications.
Keynote speaker:
Dr. Dan PUPEZA
Manager
REP Radio Engineering Pupeza
Keynote presentation:
News about RFID Antennas
Dan Pupeza received MS, Electronics Engineer/Physicist, from the Polytechnic Institute, Bucharest, Romania in 1968. Till 1978 he was Research engineer and project coordinator for military communications equipment at the Electronic research Institute in Bucharest, Romania.