SIITME 2025 committee is proud to present confirmed
Professional Development Courses:

PDC A – title:

A PCB DFM Checklist Helps You Pass a Design Review

Abstract:

The PDC “A PCB DFM Checklist Helps You Pass a Design Review” examines the traditional Excel-based PCB release process—project identification, schematic compliance, fabrication, assembly, and testability checks—and the bottlenecks of manual measurements.
DFM software uses fabricator constraint profiles to automate spacing, solder-mask, and test-point validations, instantly flagging violations.
Continuously updated DFM and assembly profiles align with evolving manufacturing capabilities, streamlining approvals and focusing teams on critical project-specific concerns.

Course Outline:

• Part 1: The Traditional PCB Release Process (20 min)
  • Overview of checklist-based validation
  • Common bottlenecks in release meetings

  Part 2: Introduction to DFM Tools (30 min)

  • What is DFM and benefits of early validation?
  • How DFM tools work with fabricator profiles

  Part 3: Modernizing the Checklist (30 min)

  • Automating checks with DFM
  • Key questions to include in a modern checklist
  • Reducing manual measurements and errors

  Part 4: Collaborative Review and Best Practices (30 min)

  • Using DFM reports to guide discussions

Trainer:

Paul CARPINE
Account Technology Manager

Siemens EDA

After graduating the “Politechnica” University of Timisoara (Romania), Paul CARPINDE started his career as SMT Process Engineer in Flex, more than 15 years ago. From 2009 he moved to Automotive Industry and worked for Forvia (Hella) as a NPI Engineer and later as a Prototyping Manager. Since 2016 he is living in Germany and developed his career in design for manufacturing and design for reliability, working for ZF and Marquardt Group.  He joined Siemens EDA in 2022 bringing the practical experience in electronics manufacturing and design for manufacturing.

PDC B – title:

Fundamentals and Applications of Modern Interconnection Materials for Electronics Packaging

Professional Development Courses Outline:

• Part 1: Fundamentals of Interconnection Technologies
  • Differences between soldering, hybrid sintering and sintering
  • Overview of material properties

   Part 2: Process in Detail

  • Soldering: classical technologies, strengths & limitations
  • Hybrid Sintering: principles, material combinations, process window
  • Sintering: mechanisms, requirements, reliability

   Part 3: Application Examples & Case Studies

  • Trends in reliability and miniaturization
  • Automotive and industrial applications
  • Power electronics

   Part 4: Practical Aspects & Discussion

  • Selecting the right interconnection technology
  • Selection of suitable test methods
  • Common failure modes and mitigation strategies

Trainer:

Martin METZLER
Senior Manager Technical Business Development

MacDermid Alpha Electronic Solutions

Martin Metzler is Senior Manager Business Development at MacDermid Alpha Electronics Solutions, where he leads since two years a Europe-wide team focusing on Technical Business Development across Circuit Board Assembly and Semiconductor Assembly Solutions. His work centers on early customer engagement and the integration of advanced materials and processes into electronic applications. Prior his current position, he spent over twelve years at Continental AG and Vitesco Technologies in roles spanning power electronics development, materials and process innovation, and technology management. He most recently managed SiC power module development and established a global expert network on sintering. Martin holds a Dipl.-Ing. degree in engineering from the University of Applied Sciences in Nuremberg, specialising in manufacturing technology.