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2020 IEEE 26th Edition

The organising committee of SIITME 2020 kindly invites you to submit an abstract/paper to the 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME). The scientific event will take place in Pitesti, Romania, on October 21st–24th, 2020.

Submission of abstracts/papers

Authors are invited to submit an abstract/paper to SIITME 2019 using the conference management system powered by Microsoft’s Academic Conference Management Service.