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THE ELECTRONIC WEEK OF ELECTRONICS PACKAGING COMMUNITY 2021
ONLINE, 25th-30th OCTOBER 2021
2 EVENTS: TIE (TIEplus) & IEEE SYMPOSIUM SIITME

General Information

The SIITME 2020 Steering Committee has, in agreement with IEEE and IEEE Hungary &Romania EPS&NTC Joint Chapter, decided to run SIITME 2020 as a virtual, live conference on the CISCO Webex platform  on the dates originally scheduled (21-24 October 2020).

This will ensure a high-quality conference to be held independent of what restrictions may apply in October 2020. The live format will allow interaction similar to an in-person conference. The digital format will give new possibilities, such as recording of presentations allowing to catch up presentations in parallel sessions.

Organizing details concerning the virtual, live format will be communicated in advance before the conference, along with the digital requirements of the interactive plenary and poster sessions.

Agenda and important information

Authors Area

Authors are invited to submit an abstract/paper to SIITME 2020 using the conference management system powered by Microsoft’s Academic Conference Management Service.

POSTER Sessions - Video Pitches & e-Posters

SIITME is an IEEE Conference. Papers meeting quality criteria are indexed IEEE Xplore Digital Library and Thomson-Reuters ISI-CPCI.

PARTNERS

logo_UPIT
UPB200_logo
iMAPS Romania
logo_conceput_in_romania
LogoETTI
IEEE_Romania_Section_logo

SPONSORS SIITME 2020

wurth_logo

EXHIBITORS SIITME 2020

SIITME2019 Photo Gallery

SIITME History

The International Symposium was founded in 1995 and each year the event takes place in a different location.

Award Winners over the years

Over the last decade the Scientific Committee of SIITME has granted several awards to international scientists based upon their contribution and presentation at the symposium.

2020 Conference Program

The Conference Program brochure is available for download.