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INDUSTRIAL WORKSHOP

“Advanced Interconnection and Disruptive Technologies,

Debate for the Future Sustainable Electronics Packaging”

26 October 2017

 

Agenda

 

Thursday, October 26

13:30 – 14:00 Registration
 

Session I – Moderators: Cosmin MOISA, Continental Automotive Romania

     Stefan TECHAU, ASM Assembly Systems

 
14:00 – 14:15 Welcome, reasoning and stakeholders introduction

Cosmin MOISA, Continental Automotive Romania

Paul SVASTA, University Politehnica of Bucharest, Romania, Association for Promoting Electronics Technology
14:15 – 14:30 EMS status quo

Tiberiu SIMIONAS, Continental Automotive Romania

László RÉDEY, Deery Brook SRL – Alpha Assembly Solution
14:30 – 14:35 Q&A
14:35 – 14:50 Reliability challenge of the electronic products

Frédéric KRATZ, National Institutes of Applied Sciences INSA

Ioan PLOTOG, University Politehnica of Bucharest, Romania
14:50 – 14:55 Q&A
14:55 – 15:10 Front end assembly capability – state of the art

Ferenc CSIZMAZIA, ASM Assembly Systems
15:10 – 15:15 Q&A
15:15 – 15:30 Coffee break
 

 

Session II – Moderators:

Joseph FJELSTAD, Verdant Electronics, USA

Paul SVASTA, University Politehnica of Bucharest, Romania, Association for Promoting Electronics Technology

 
15:30 – 15:45 PCB suppliers – actual challenges

Fabio Puccia MODICA, Tecnometal / Martino TADDEI, GESTLABS

Mihai Fedoreac – Continental Automotive Romania
15:45 – 15:50 Q&A
15:50 – 16:10 OCCAM – Introduction and trials

Ciprian IONESCU, Gaudentiu VARZARU, Mihai BRANZEI

University Politehnica of Bucharest, Romania
16:10 – 16:25 Q&A
16:25 – 16:35

 

 

16:35 – 16:45

 Back end assembly – further steps

Tiberiu SIMIONAS, Continental Automotive Romania

Marian ONICA, Continental Automotive Romania

Supporting open innovation to raise entrepreneurship and public private partnership – DA-SPACE project vision

Bogdan MIHĂILESCU, Association for Promoting Electronic Technology
16:45 – 16:50 Next steps and further workshop potential

Cosmin MOISA, Continental Automotive Romania