James E. Morris
Department of Electrical & Computer Engineering, Portland State University, USA
email@example.com | firstname.lastname@example.org
”Polymer composites for electronics packaging applications”
Jim is a Professor of Electrical & Computer Engineering at Portland State University, Oregon, and Professor Emeritus at the State University of New York at Binghamton. His B.Sc. and 1st Class Honors M.Sc. degrees in Physics are from the University of Auckland, New Zealand, and his Ph.D. in Electrical Engineering is from the University of Saskatchewan, Canada. He has served as Department Chair at both Binghamton and Portland, and was the founding Director of Binghamton’s Institute for Research in Electronics Packaging. Other positions have included Senior Technician and Post-Doctoral Fellow at the U of S, brief periods with Delphi Engineering (NZ) and IBM-Endicott (New York), and industrial consulting. Jim is an IEEE Fellow and an IEEE Components, Packaging, & Manufacturing (CPMT) Society Distinguished Lecturer. He has served as CPMT Treasurer (1991-1997) and Vice-President for Conferences (1998-2003), and currently sits on the CPMT Board of Governors (1996-1998, 2011-2016) and on the joint Oregon CAS/CPMT Chapter executive committee, and co-chairs the CPMT Nanotechnology technical committee. He was awarded the IEEE Millennium Medal and won the CPMT David Feldman Outstanding Contribution Award in 2005. He is an Associate-Editor of the IEEE CPMT Transactions and has been General Chair of three CPMT-sponsored conferences, Treasurer or Technical Chair of others, and serves on several CPMT conference committees. As the CPMT Society representative on the IEEE Nanotechnology Council (NTC), he instituted a regular Nanopackaging series of articles in the IEEE Nanotechnology Magazine, established the NTC Nanopackaging technical committee, (which also acts as a program committee for annual IEEE NANO conferences,) served as the 2010-2012 NTC Awards Chair, chaired the IEEE NANO 2011 conference in Portland, serves as NTC Vice-President for Conferences (2013-2014,) and is VP-elect for Finances (2015-2016.) He also co-founded the Oregon Chapter of the IEEE Education Society in 2005 and sits on its executive committee, and was Program Chair for the 1st and 2nd IEEE Conferences on Technology for Sustainability (2013/14). His research activities are focused on electrically conductive adhesives, the electrical conduction mechanisms in discontinuous nanoparticle thin metal films, with applications to nanopackaging and single-electron transistor nanoelectronics, and on an NSF-funded project in undergraduate nanotechnology education. He has edited or co-authored five books on electronics packaging and two on nanodevices, and lectures internationally on nanopackaging and electrically conductive adhesives.
Prof. Dr.-Ing. habil. Dr. H. C. Mult. Klaus-Jürgen Wolter
Technische Universität Dresden, Germany
”Through Silicon Vias Annealing: A thermo-mechanical assessment”
• Between 2006-2014 – Deputy Head of Fraunhofer IZFP Dresden
• Between 2003-2014 – Director of the Electronic Packaging Lab at Dresden University of Technology
• Between 2002-2012 – Director of the Centre of Microtechnical Manufacturing
• 1992 Appointment to the chair of Procedure Technology of Electronics
Fields of research:
• Substrate technologies
• Assembly technologies of devices, components, MEMS
• Joining technologies
• Reliability of electronic packages
• Non-destructive test methods
• Co-author of four books in Electronics Packaging
• Editor of book series: „Elektronik-Technologie in Forschung und Praxis“
• Verlag Dr. Markus Detert, Templin, Band 1 – 16
• Editor of book series: „System Integration in Electronic Packaging“
• Verlag Dr. Markus Detert, Templin, Band 1 – 5
• The research activities result in more than 80 conference presentations/proceedings and in 3 patents.
Fellowships and Honours
• Member of: IEEE-CPMT (since 2005), IMAPS, VDE
• General Chair of “International Spring Seminar on Electronic Technology” since 2003
• Chair of the 5th and 8th International Academic Conference on Electronic Packaging Education and Training
• General Chair of 1st Electronics System- Integration Technology Conference 2006
Governor of IEEE-CPMT board since 2006
Director CEA LETI
”Energy efficient nanoelectronics”
Hervé Fanet was born in 1949. He received the engineer’s diploma from the “Ecole Supérieure d’Electrricité”.
He was involved in detectors and electronic developments for High Energy Particle Physics. After that he was in charge of medical imaging research in LETI and has been the manager of integrated circuits design department.
Hervé Fanet is research engineer at CEA LETI. He is in charge of scientific cooperation and training activities within the MINATEC pole (micro and nanotechnologies) in Grenoble.
He has published 40 papers in journals and is author or co-author of five books.
Traian Cornel Cucu
Global Product Manager Solder Paste, Alpha, USA
”Advances in Automotive Electronics Soldering Technology -Low Temperature Solder Paste, the why’s and the how’s”
Traian Cucu is presently working as Global Product Manager Solder Paste at Alpha (former Cookson Electronics Assembly Materials) an is responsible for Planning, organizing and controlling all aspects of the solder paste product line from conceptual stage through product life cycles. He received his B.Sc degree from “Politehnica” University of Timisoara, , Faculty of Electrical and Power Engineering, Specialization: Industrial Power Systems and his PhD. from Politechnica University of Bucharest, Faculty of Electronics, Telecommunications and Information Technologies, Specialization: Electronic Technology. He was part of the technical team from Cookson Electronics that was implementing tin-lead SMT process in late 1990s during the transition from THT to SMT. Early 2000s he was involved in the development and implementation of the lead free technology for both wave and SMT processes, working for Cookson Electronics and Brady. He was working with major mobile phone OEMs in order to implement new processes that will enable a quicker transition to finer pitch designs and 3D assembly systems for the next generation devices. He was also actively involved, while working with Brady, in the process traceability in electronics with a big accent on the automotive industry. As part of the Alpha technical team he was continuing his work in the assembly process focusing on tin-lead and lead free processes for automotive, during a 3 year period starting 2007.