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THE ELECTRONIC WEEK OF ELECTRONICS PACKAGING COMMUNITY 2023

17th-21st OCTOBER 2023, Craiova, Romania

EW 2023 - BROCHURE - AVAILABLE
2nd SUMMIT OF IEEE EPS & NTC STUDENT BRANCH CHAPTERS- BROCHURE - AVAILABLE

General Information

The SIITME Steering Committee, in agreement with IEEE and IEEE Hungary & Romania EPS&NTC Joint Chapter, is organising SIITME 2023 as a in-person, traditional conference on the 18th – 20th October 2023 in Craiova, Romania.

Organizing details concerning the participation, venue, accommodation and transportation will be communicated in advance before the conference, along with the requirements of the interactive plenary and poster sessions.

Agenda and important information

Electronic Week 2023 - Short Program - AVAILABLE
Keynote and PDCs Speakers - SIITME 2023
Electronic Week 2023 - Location & Venue
Conference Committees 2023

Registration and Sponsorship

Conference Registration SIITME 2023 - OPENED
Exhibition packages ELECTRONIC WEEK - OPEN
Sponsorship packages 2023 - ELECTRONIC WEEK

SIITME Retrospective

Retrospective: ORAL & POSTER Sessions Detailed Program - SIITME 2022

Authors Area

IMPORTANT DATES
Submission of abstracts [CLOSED]:	30th of June 2023
Notification of abstract acceptance:	1st of August 2023
Authors and participants registration
EARLYBIRD deadline:	1st of September 2023
Submission of camera-ready papers [EXTENDED]:	2nd of October 2023
Review of camera-ready papers:	8th of October 2023
Submission of modified camera-ready papers
(post-review) and copyright forms:	15th of October 2023
Submission of SIITME 2023 presentations and video pitch:	10th of October 2023
Authors and participants registration deadline:	15th of October 2023
SIITME 2023 CMT - Submission Registration/Login - CLOSED
SIITME 2023 Poster Session 1 - ePosters and Video Gallery
SIITME 2023 Poster Session 2 - ePosters and Video Gallery
SIITME 2023 Poster Session 3 - ePosters and Video Gallery
EW 2023 - Programme in Detail - Poster and Oral Sessions - AVAILABLE
SIITME 2023 Oral & Poster Requirements

Authors are invited to submit an abstract/paper to SIITME 2023 using the conference management system powered by Microsoft’s Academic Conference Management Toolkit.

Call for Papers - SIITME 2023
SIITME 2023 Abstract Template
SIITME 2023 Paper Template

SIITME is an IEEE Conference. Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements. Papers meeting quality criteria are indexed IEEE Xplore Digital Library and Clarivate Web of Science Core Collection ISI-CPCI.

The SIITME2022 papers which met the quality criteria have been published on IEEE eXplore and are available here.

All submissions went through the established process of evaluation, presentation and publication following the IEEE regulations.
Those papers that met all the formal and scientific quality criteria were published.

The SIITME2022 papers which met the quality criteria have been published on Web of Science – CLARIVATE (ISI) and are available here. (institutional access might be requested)

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PARTNERS

University of Craiova
University of Craiova
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iMAPS Romania
UPB200_logo

DIAMOND SPONSORS 2023

GOLD SPONSORS 2023

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SILVER SPONSORS 2023

ZEISS

EXHIBITORS SIITME 2023

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SIITME2019 Photo Gallery

Open Gallery
  • 04-SIITME2019_Poster_Sessions_18
  • 06-SIITME2019_Awarding_Session_05
  • 05-SIITME2019_Industrial_Sessions_08
  • 03-SIITME2019_Oral_Sessions_18
  • 07-SIITME2019_Exhibition_26
  • 04-SIITME2019_Poster_Sessions_20
  • 06-SIITME2019_Awarding_Session_08
  • 04-SIITME2019_Poster_Sessions_23
  • 04-SIITME2019_Poster_Sessions_17
  • 03-SIITME2019_Oral_Sessions_34
  • 06-SIITME2019_Awarding_Session_10
  • 07-SIITME2019_Exhibition_03
SIITME History

The International Symposium was founded in 1995 and each year the event takes place in a different location.

Award Winners over the years

Over the last decade the Scientific Committee of SIITME has granted several awards to international scientists based upon their contribution and presentation at the symposium.

2022 Conference Program

The Conference Program brochure is available for download.

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