THE ELECTRONIC WEEK OF ELECTRONICS PACKAGING COMMUNITY 2021 ONLINE, 25th-30thOCTOBER 2021
2 EVENTS: TIE (TIEplus)& IEEE SYMPOSIUM SIITME
The SIITME Steering Committee has, in agreement with IEEE and IEEE Hungary &Romania EPS&NTC Joint Chapter, decided to run SIITME 2021 as a virtual, liveconference on the 27th – 30th October 2021.
This will ensure a high-quality conference to be held independent of what restrictions may apply in October 2021. The live format will allow interaction similar to an in-person conference. The digital format will give new possibilities, such as recording of presentations allowing to catch up presentations in parallel sessions.
Organizing details concerning the virtual, live format will be communicated in advance before the conference, along with the digital requirements of the interactive plenary and poster sessions.
The organising committee of SIITME 2021 kindly invites you to submit an abstract/paper to the 2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME).
The scientific and technical event event will take place on October 27th–30th, 2021 as an ONLINE / LIVE virtual conference.
SIITME is an IEEE Conference. Papers meeting quality criteria are indexed IEEE Xplore Digital Library and Clarivate Web of Science Core Collection ISI-CPCI.
Submission of abstracts [EXTENDED]:15th of June 2021
Notification of abstract acceptance: 2nd of August 2021
Submission of camera-ready papers: 1st of September 2021
Review of camera-ready papers: 1st of October 2021
Submission of modified camera-ready papers (post-review): 20th of October 2021
Submission of SIITME 2021 presentations : 25th of October 2021
Authors registration deadline: 16th of October 2021
Participants registration deadline: 16th of October 2021All submissions are going through the established process of evaluation, presentation and publication following the IEEE regulations.