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THE ELECTRONIC WEEK OF ELECTRONICS PACKAGING COMMUNITY 2023

18th-22th OCTOBER 2023, Craiova, Romania

General Information

The SIITME Steering Committee, in agreement with IEEE and IEEE Hungary & Romania EPS&NTC Joint Chapter, is organising SIITME 2023 as a in-person, traditional conference on the 18th – 20th October 2023 in Craiova, Romania.

Organizing details concerning the participation, venue, accommodation and transportation will be communicated in advance before the conference, along with the requirements of the interactive plenary and poster sessions.

Agenda and important information

Registration and Sponsorship

Authors Area

Authors are invited to submit an abstract/paper to SIITME 2023 using the conference management system powered by Microsoft’s Academic Conference Management Toolkit.

SIITME is an IEEE Conference. Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements. Papers meeting quality criteria are indexed IEEE Xplore Digital Library and Clarivate Web of Science Core Collection ISI-CPCI.

The SIITME2022 papers which met the quality criteria have been published on IEEE eXplore and are available here.

All submissions went through the established process of evaluation, presentation and publication following the IEEE regulations.
Those papers that met all the formal and scientific quality criteria were published.

SIITME Retrospective

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PARTNERS

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iMAPS Romania
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PLATINUM SPONSORS 2022

GOLD SPONSORS 2022

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SILVER SPONSORS 2022

EXHIBITORS SIITME 2022

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SIITME2019 Photo Gallery

SIITME History

The International Symposium was founded in 1995 and each year the event takes place in a different location.

Award Winners over the years

Over the last decade the Scientific Committee of SIITME has granted several awards to international scientists based upon their contribution and presentation at the symposium.

2022 Conference Program

The Conference Program brochure is available for download.

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