SIITME 2024 committee is proud to present confirmed
Keynote Speakers, Professional Development Courses and Industrial Invited Speakers:

PDC A – 16 October 9:00 – 12:30 – title:

What does a Vector Network Analyzer tell us about our high-speed design?

Abstract:

This tutorial will present a different kind of network, which was defined long before any of the previous networks existed, and it even contributed to their development. The first Vector Network Analyzer (VNA) was invented around 1950 and was defined as an instrument that measures the frequency response of a component or a network composed of many components, which can be both passive and active.

Course Outline:

• Scattering or S-parameters
• Introduction to Vector Network Analysis
• Time Domain and Frequency Domain Network Analysis compared
• Time Domain Reflectometer, Scope, Spectrum analyzer, VNA
• What a VNA can tell us
• Setup a VNA measurement
• When, Why, and how to calibrate a VNA
• What is De-embedding
• Tips and tricks that can improve your measurement and protect your equipment

Trainers:

Radu Voina
Founder/CEO

Keytek Innovation

Radu Voina holds a Master’s Degree in Applied Electronics (2018) and a Bachelor’s Degree in Telecommunications Technologies and Systems (2015) from the Technical University of Cluj-Napoca. He founded Keytek Innovation, a Value-Added Reseller (VAR) for Rhode & Schwarz in Romania, and has made a significant impact in mixed-signal board schematics, PCB design, and the analysis of signal and power integrity for high-speed interfaces, utilizing advanced PCB layout and simulation tools.

Mihai Dărăban, PhD.
Assistant Professor

Technical University of Cluj-Napoca

Mihai Dărăban received the Dipl.-Ing. degree in electronics engineering specialization telecommunication from the Technical University of Cluj-Napoca, and the Ph.D. degree in electronics and telecommunications from the Applied Electronics Department, Technical University of Cluj-Napoca (UTCN) in 2013. He is currently an Assistant Professor with the Applied Electronics Department, and member of Information Technology in Electronics Research and Development Centre (iTEC), UTCN.

PDC B – 16 October 9:00 – 12:30 – title:

Wire bonding technologies and their relevance and applications in future packaging trends

Abstract:

As the packaging landscape rapidly changes, this tutorial looks to examine the different variations of modern wire bonding interconnect.

How relevant these solutions are to the next generation of automotive and consumer packages.

As well as the direction of other interconnect solutions within the modern mass production packaging space.

Trainer:

Simon Broadhurst

Kulicke & Soffa

Keynote speaker:

Stefan Chitoraga
Technology & Market Analyst specializing in semiconductor Packaging and Assembly

Yole Group

Keynote presentation:
”Advanced Packaging Market Outlook, technology trends and how Europe positions itself for this business.”

Stefan Chitoraga is Technology & Market Analyst specializing in Semiconductor Packaging. Within the Manufacturing & Global Supply Chain activities at Yole Group, Stefan is focused on advanced packaging platforms and processes, substrates, and PCBs. He is involved daily in the production of technology & market products and custom consulting projects.

Keynote speaker:

Mircea Guina
Professor of Semiconductor Technology

Tampere University, Finland

Keynote presentation:
”Emerging microelectronics platforms based on hybrid integration”

Prof. Mircea Guina leads the Optoelectronics Research Centre at the Tampere University, Finland. He obtained the BSc degree (1996) in microelectronics and MSc degree (1997) in photonics from “Politehnica” University of Bucharest, and the PhD degree (2002) in physics at Tampere University of Technology. Prof. Guina’s research is focused on developing compound semiconductors for optoelectronics using molecular beam epitaxy, and advanced photonic devices.

Keynote speaker:

Syhem Larguech
Application Engineer

Cadence Design Systems

Keynote presentation:
”Advanced IC packaging in the context of multi-chiplet based architectures”

Syhem Larguech received the Dipl.-Ing. degree in electrical engineering from the National Engineering School of SFAX (ENIS), Sfax, Tunisia, in 2012. She earned a PhD degree in Microelectronic Systems from the University of Montpellier, Montpellier, France, in 2015. In 2016, she joined the Interuniversity Microelectronics Centre (IMEC), where she was involved in IC package design and electrical analysis for various applications such as space and high speed.

Keynote speaker:

Dr. Philipp Weigell
Vice President of the Market Segment Industry, Components, Research and Universities

Rohde & Schwarz

Keynote presentation:
”Challenges and Solutions in Building AI Data Centers: A Component-Level Perspective”

Dr. Philipp Weigell has a strong background in physics and electrical engineering, with a focus on developing innovative solutions for applications, such as battery testing, high-speed digital compliance testing, renewable energy and particle accelerators. He is also an expert on the semiconductor ecosystem.

Industrial Invited speaker:

Nicolae Gross
Test engineer and hardware development engineer

Continental Automotive Systems

Keynote presentation:
”Electronic component qualification for
the automotive industry”

Nicolae Gross –  Electronic engineer and PhD. student,  graduated in 1996 the Technical University of Cluj-Napoca, Applied Electronics. He works in automotive industry, as test engineer and hardware development engineer, with more than 19 years experience. Since 2006 is employee of Continental Automotive Systems Sibiu. His activity was focused mostly on test equipment development, from concept definition to final assembly and delivery to the customer. He is in charge of coordinating a team of development engineers which develop not only the hardware equipment, but also the automation sequences for prototype testing and production line test equipment.

Industrial Invited speaker:

Cosmin Moisa
Head Microelectronics Integration Technology Organisation Timisoara

Continental Automotive Romania

Cosmin Moisa – studied between 1999 – 2006 Electrical Engineering at Politehnica University of Timisoara with a diploma stage with a 6-month contract at the “Fraunhofer Institute for Manufacturing Engineering and Automation” IPA in Stuttgart, Germany. In 2005, he started as Hardware Engineer at Siemens VDO, Timisoara. Since 2010, he joined the Interconnection Techniques in Electronics (TIE) contest as General Industrial Co-Chair and the IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) as Conference Co-Chair. In 2011, he started as Head of Department for Hardware and System Engineering. Between 2012 – 2019 he was Associated Lecturer and coordinator for the external class Development of Electronic Products. Between 2015-2022, he was heading the Product Development Center, Camera and Interior Sensing Timisoara. In 2020, he co-organized and hosted the kick-off for the IEEE Hungary & Romania EPS & NTC Joint Chapter. He started in 2021 as IEEE Romania Section Industry Ambassador. He was nominated in 2021 as the Secretary of the Working Group Microelectronics under the Aegis of the Romanian Academy.

Industrial Invited speaker:

Radu Preda
Manager of Partnerships under Subsidy Projects

NXP Semiconductors Romania

Radu Preda received his engineering diploma in Computer Science in 1996, from the Military Technical Academy, Bucharest, Romania. In 2012 he graduated the Executive Master of Business Administration from ASEBUSS, Romania and Kennesaw State University, GA, USA. He is experienced in developing embedded systems, with focus on real time applications. Radu had multiple management roles with NXP Semiconductors (previously Motorola, then Freescale Semiconductors) and Fotonation, with contributions to developing new business based on innovative products. He is a promoter of entrepreneurship and intrapreneurship in multicultural environments.