Dear Colleagues,

The organising committee of SIITME 2018 kindly invites you to submit an abstract/paper to the 2018 IEEE 24^th International Symposium for Design and Technology in Electronic Packaging (SIITME). The scientific event will take place in Iași, on October 25^th–28^th, 2018. Web page: https://www.siitme.ro

SUBMISSION OF ABSTRACTS AND PAPERS

Interested authors are invited to submit a two-page abstract according to the template, as MS-Word document, Version 97 or later, and as PDF document, using the SIITME Conference Management System.

Papers meeting the quality criteria will be included in the IEEE Xplore Digital Library and Thomson-Reuters ISI-CPCI.
Abstracts and papers will be reviewed by the international Scientific Committee.

1.  Each abstract will be reviewed on:
– suitability for one of the topics of the conference
– scientific content and level, and the relevance of presented results;
– correspondence with the abstract template, English usage and grammar.

Authors of accepted abstracts will be invited to submit a full-length conference paper according to the conference paper template.
2.  Papers meeting the following criteria will be published in the Conference Proceedings and will be available through IEEE Xplore:
– the comments of the reviewers have been taken into consideration;
– originality of the paper[1] is given;
– it corresponds with the paper template, English usage and grammar are correct,
– signed IEEE copyright form has been submitted.

TOPICS

A. Emerging Technologies & Trends in Advanced Packaging, MEMS, Heterointegration, Printed Electronics, Smart Textiles, Healthcare
B. Components, Assembling and Manufacturing Technology
C. Integrated circuits, Embedded systems, Power electronics and Thermal management
D. Virtual prototyping and System validation
E. IoT, Communication, Aerospace, Robotics and Artificial Intelligence
F. Optoelectronics, Display technology, Smart Lighting, Renewable Energy
G. Smart Grid, Intelligent Transport Systems and Vehicle Electrification
H. Applied Reliability, Characterization and Testing, Failure Diagnostic
I. Challenges in Global Education

IMPORTANT DATES

CHAIRS

General Chair:
Paul SVASTA, “Politehnica” University of Bucharest, Romania
General Academic Co-Chair:
Dan PITICĂ, Technical University of Cluj-Napoca, Romania
General Industrial Co-Chair:
Marian PETRESCU, Continental Automotive, Iasi

Conference Chair:
Daniela TĂRNICERIU, Gheorghe Asachi Technical University of Iaşi, Romania
Conference Co-Chair:
Cosmin MOISA, Continental Automotive, Timisoara, Romania

Technical Program Chair:
Detlef BONFERT, Fraunhofer EMFT, Münich, Germany
Technical Program Co-Chair:
Norocel CODREANU, “Politehnica” University of Bucharest, Romania

Awards Committee Chair:
Heinz WOHLRABE, Dresden University of Technology, Dresden, Germany

Scientific Committee Chair:
Balázs ILLÉS, Budapest University of Technology and Economics, Hungary
Scientific Co-Chairs:
Heinz WOHLRABE, Dresden University of Technology, Germany
Ciprian IONESCU, “Politehnica” University of Bucharest, Romania

Promotion & Advertising Committee Chair:
Ioan PLOTOG, “Politehnica” University of Bucharest, Romania

Human Resource Education and Training Committee Chair:
Aurelia FLOREA, MIELE Tehnica, Braşov, Romania

Publication Chair:
Gabriel CHINDRIŞ, Technical University of Cluj- Napoca, Romania
Publication Co-Chair:
Bogdan MIHĂILESCU, “Politehnica” University of Bucharest, Romania
International Publication Advisor:
Zsolt ILLYEFALVI-VITÉZ, Budapest University of Technology and Economics, Hungary