Dear Colleagues,

The organising committee of SIITME 2023 kindly invites you to submit an abstract/paper to the 2023 IEEE 29^th International Symposium for Design and Technology in Electronic Packaging (SIITME), organized in Craiova, Romania. The scientific event will be held on October 18th–20th, 2023.

SUBMISSION OF ABSTRACTS AND PAPERS

Interested authors are invited to submit a two-page abstract according to the template, as MS-Word document and as PDF document, using the SIITME Conference Management System.

Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements.

Abstracts and papers will be reviewed by the International Scientific Committee of SIITME.

1.  Each abstract will be reviewed on:
– suitability for one of the topics of the conference
– scientific content and level, and the relevance of presented results;
– correspondence with the abstract template, English usage and grammar.

Authors of accepted abstracts will be invited to submit a full-length conference paper according to the conference paper template.

2.  Papers meeting the following criteria will be published in the Conference Proceedings and will be available through IEEE Xplore:
– the comments of the reviewers have been taken into consideration;
– originality of the paper[1] is given;
– it corresponds with the paper template, English usage and grammar are correct,
– signed IEEE copyright form has been submitted.

TOPICS

A. Emerging Topics in Advanced Packaging;
B. New Components and Manufacturing Technologies;
C. Printed Electronics, Smart Textiles and Healthcare;
D. Sensors, Actuators and Microsystems;
E. Nanomaterials, Nanoelectronics and Nanotechnology;
F. Embedded Systems, Robotics and Artificial Intelligence;
G. Power Electronics and Thermal Management;
H. Smart Grid and Renewable Energy;
I. Virtual Prototyping and System Validation;
J. Quality Management, Applied Reliability, Characterization and Testing Failure Diagnosis;
K. Corrosion in Electronics;
L. Challenges in Digitalisation and Global Education for Electronics.

IMPORTANT DATES

CHAIRS

General Chair:
Paul SVASTA, University Politehnica of Bucharest, Romania
Association for Promoting Electronics Technology
General Academic Co-Chair:
Dan PITICĂ, Technical University of Cluj-Napoca, Romania
General Industrial Co-Chair:
Cristian GAVRILESCU, Continental Automotive, Romania

Conference Chair:
Mircea Cătălin CONSTANTINESCU, University of Craiova, Romania
Conference Co-Chair:
Cosmin MOISA, Continental Automotive, Timișoara, Romania

Technical Program Chair:
Detlef BONFERT, Fraunhofer EMFT, Münich, Germany
Technical Program Co-Chair:
Norocel CODREANU, “Politehnica” University of Bucharest, Romania

Awards Committee Chair:
Heinz WOHLRABE, Dresden University of Technology, Dresden, Germany
Ovidiu Aurel POP, Technical University of Cluj-Napoca, Romania

Scientific Committee Chair:
Balázs ILLÉS, Budapest University of Technology and Economics, Hungary
Scientific Co-Chairs:
Heinz WOHLRABE, Dresden University of Technology, Germany
Ciprian IONESCU, “Politehnica” University of Bucharest, Romania

Exposition Committee Chair:
Rajmond JÁNÓ, Technical University of Cluj Napoca, Romania
Exposition Committee Co-Chairs:
Rodica CONSTANTINESCU, University Politehnica of Bucharest, Romania
Raul IONEL, Continental Automotive, Timișoara, Romania

Human Resource Education and Training Committee Chair:
Aurelia FLOREA, MIELE Tehnica, Braşov, Romania
Human Resource Education and Training Committee Co-Chair:
Bálint MEDGYES, Budapest University of Technology and Economics, Hungary
Human Resource Education and Training Committee Edition Chair:
Maria MARCOVICI, Continental Automotive, Timișoara, Romania

Publication Chair:
Gabriel CHINDRIŞ, Technical University of Cluj- Napoca, Romania
Publication Co-Chair:
Bogdan MIHĂILESCU, “Politehnica” University of Bucharest, Romania

Professional Development Courses and International Publication Advisor:
Zsolt ILLYEFALVI-VITÉZ, Budapest University of Technology and Economics, Hungary

Social Media Committee Chair: 
Monica CIOLACU, University of Passau, Germany
Social Media Committee Co-Chair:
Alina MARCU, University Politehnica of Bucharest, Romania

CONFERENCE REGISTRATION OPENS on 1st of July 2023

The conference fee includes full access to all conference sessions (workshops, industrial, oral and poster sessions) and digital conference proceedings.

LOCATION

Craiova, Romania | Please visit the VENUE information click here!

CONTACT INFORMATION:

Registration Officer

Delia Lepădatu

0040.720.093.945
0040.769.247.904

Tel:      0040 213169633 / 0040 214024638
Fax:      0040 213169634
E-mail:   siitme@cetti.ro
https://www.siitme.ro

Correspondence address:
Splaiul Independentei 313
06042, Bucharest, Romania