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Header SIITME 2021

THE ELECTRONIC WEEK OF ELECTRONICS PACKAGING COMMUNITY 2021

– Preliminary program –

Monday, October 25
09:00 – 09:30 Opening ceremony for the Electronic Industry Week
09:30 – 10:00 TIEPlus opening, subject introduction
10:00 – 12:30 TIEPlus CONTEST
12:30 – 14:00 Lunch Break
14:00 – 16:00 TIEplus Virtual Prototype Workshop
16:30 – 18:00 TIEplus 2021 subject demystification
18:00 – 19:00 TIE– technical session
Tuesday, October 26
07:45 – 08:15 TIE contest preliminary activities
08:15 – 12:45 TIE CONTEST
12:45 – 14:00 Lunch Break
14:00 – 20:00 Assessment of the projects; litigations
20:00 – 21:30 TIE 2020 Committee Meeting
Wednesday, October 27
09:00 – 12:00 Pact for Skills EU workshop
12:00 – 12:45 TIE 2021 subject demystification
12:45 – 13:30 TIE and TIEplus Awarding ceremony
13:30 – 14:30 Lunch Break
14:30 – 18:30 Professional Development Course
18:30 – 20:30 IEEE – Hu & RO EPS&NTC Joint Chapter Meeting
Thursday, October 28
08:30 – 08:50 Opening ceremony
09:00 – 11:10 Plenary Oral Session 1
11:20 – 13:30 Plenary Oral Session 2
13:30 – 14:00 Lunch Break
14:00 – 14:50 Industrial Session 1
14:50 – 16:20 Poster Session 1
16:30 – 18:40 Plenary Oral Session 3
18:40 – 20:00 Networking IEEE, IMAPS Student Branch Chapter Kick-off Meeting
Friday, October 29
08:30 – 10:00 Poster Session 2
10:10 – 10:50 Special Session
10:50 – 12.20 Plenary Oral Session 4
12:20 – 12:50 Industrial session 2
12:50 – 13:20 Lunch Break
13:20 – 14:40 Industrial Workshop
14:40 – 16:10 Poster Session 3
16:20 – 17:50 Plenary Oral Session 5
17:50 – 19:30 Steering Committee Meeting
19:30 – 20:30 Awarding ceremony & Welcome to SIITME 2022 & ESTC2022

EEST | GMT +3h

updated 31st May 2021