Dear Colleagues,

The organising committee of SIITME 2019 kindly invites you to submit an abstract/paper to the 2019 IEEE 25^th International Symposium for Design and Technology in Electronic Packaging (SIITME). The scientific event will take place in Cluj-Napoca, on October 23^rd–26^th, 2019. 

SUBMISSION OF ABSTRACTS AND PAPERS

Interested authors are invited to submit a two-page abstract according to the template, as MS-Word document and as PDF document, using the SIITME Conference Management System.

Papers meeting the quality criteria will be included in the IEEE Xplore Digital Library and Thomson-Reuters ISI-CPCI.
Abstracts and papers will be reviewed by the international Scientific Committee.

1.  Each abstract will be reviewed on:
– suitability for one of the topics of the conference
– scientific content and level, and the relevance of presented results;
– correspondence with the abstract template, English usage and grammar.

Authors of accepted abstracts will be invited to submit a full-length conference paper according to the conference paper template.
2.  Papers meeting the following criteria will be published in the Conference Proceedings and will be available through IEEE Xplore:
– the comments of the reviewers have been taken into consideration;
– originality of the paper[1] is given;
– it corresponds with the paper template, English usage and grammar are correct,
– signed IEEE copyright form has been submitted.

TOPICS

A. Emerging Topics in Advanced Packaging;
B. New Components and Manufacturing Technologies;
C. Printed Electronics, Smart Textiles and Healthcare;
D. Sensors, Actuators and Microsystems;
E. Nanomaterials, Nanoelectronics and Nanotechnology;
F. Embedded Systems, Robotics and Artificial Intelligence;
G. Power Electronics and Thermal Management;
H. Smart Grid and Renewable Energy;
I. Virtual Prototyping and System Validation;
J. Quality Management, Applied Reliability, Characterization and Testing Failure Diagnosis;
K. Challenges in Global Education for Electronics.

IMPORTANT DATES

CHAIRS

General Chair:
Paul SVASTA, “Politehnica” University of Bucharest, Romania
General Academic Co-Chair:
Dan PITICĂ, Technical University of Cluj-Napoca, Romania
General Industrial Co-Chair:
Daniela POPESCU, Technical University of Cluj- Napoca, Romania

Conference Chair:
Gabriel OLTEAN, Technical University of Cluj- Napoca, Romania
Conference Co-Chair:
Cosmin MOISA, Continental Automotive, Timisoara, Romania

Technical Program Chair:
Detlef BONFERT, Fraunhofer EMFT, Münich, Germany
Technical Program Co-Chair:
Norocel CODREANU, “Politehnica” University of Bucharest, Romania

Awards Committee Chair:
Heinz WOHLRABE, Dresden University of Technology, Dresden, Germany

Scientific Committee Chair:
Balázs ILLÉS, Budapest University of Technology and Economics, Hungary
Scientific Co-Chairs:
Heinz WOHLRABE, Dresden University of Technology, Germany
Ciprian IONESCU, “Politehnica” University of Bucharest, Romania

Promotion & Advertising Committee Chair:
Alexandra FODOR, Technical University of Cluj- Napoca, Romania

Human Resource Education and Training Committee Chair:
Aurelia FLOREA, MIELE Tehnica, Braşov, Romania

Publication Chair:
Gabriel CHINDRIŞ, Technical University of Cluj- Napoca, Romania
Publication Co-Chair:
Bogdan MIHĂILESCU, “Politehnica” University of Bucharest, Romania
International Publication Advisor:
Zsolt ILLYEFALVI-VITÉZ, Budapest University of Technology and Economics, Hungary