2019 IEEE 25th Edition

The organising committee of SIITME 2019 kindly invites you to submit an abstract/paper to the 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME). The scientific event will take place in Cluj-Napoca, Romania, on October 23rd–26th, 2019.

Submission of abstracts/papers

Authors are invited to submit an abstract/paper to SIITME 2019 using the conference management system powered by Microsoft’s Academic Conference Management Service.