Dear Colleagues,

The organising committee of SIITME 2015 kindly invites you to submit an abstract/paper to the 2015 IEEE 21^st International Symposium for Design and Technology in Electronic Packaging (SIITME). The scientific event will take place in Brasov, on October 22^nd–25^th, 2015. Web page: https://www.siitme.ro

SUBMISSION OF ABSTRACTS AND PAPERS

Interested authors are invited to submit a two-page abstract according to the template, as MS-Word document, Version 97 or later, and as PDF document, using the SIITME 2015 Conference Management System.

Papers meeting the quality criteria will be included in the IEEE Xplore Digital Library.
Abstracts and papers will be reviewed by the international Scientific Committee.

1.  Each abstract will be reviewed on:
– suitability for one of the topics of the conference
– scientific content and level, and the relevance of presented results;
– correspondence with the abstract template, English usage and grammar.

Authors of accepted abstracts will be invited to submit a full-length conference paper according to the conference paper template.
2.  Papers meeting the following criteria will be published in the Conference Proceedings and will be available through IEEE Xplore:
– the comments of the reviewers have been taken into consideration;
– originality of the paper[1] is given;
– it corresponds with the paper template, English usage and grammar are correct,
– signed IEEE copyright form has been submitted.

TOPICS

A. Emerging Technologies & Trends in Advanced Packaging, Printed Electronics
B. Power Electronics and Microsystems Packaging
C. Assembly and Manufacturing Technology
D. Design of Electronic Circuits and Systems
E. Electronics Simulation & Modelling
F. Electronics Applications and Automotive Electronics
G. Optoelectronics & Advanced Communication Packaging
H. Applied Reliability
I. Challenge in Global Education

IMPORTANT DATES

CHAIRS

General Chair: Paul SVASTA, “Politehnica” University of Bucharest, RO
General Co-Chair: Dan PITICĂ, Technical University of Cluj-Napoca, RO
Conference Chair: Norocel CODREANU, “Politehnica” University of Bucharest, RO
Conference Co-Chair: Ciprian IONESCU, “Politehnica” University of Bucharest, RO
Technical Program Committee Chair: Detlef BONFERT, Fraunhofer EMFT in Munich, DE
Awards Committee Chair:  Heinz WOHLRABE, Technical University of Dresden, DE
Publication Committee Chair: Zsolt ILLYEFALVI-VITÉZ, BudapestUniversity of Technology and Economics, HU