Call for Papers – SIITME 2012

Dear Colleagues,

The organizing committee of SIITME 2012 kindly invites you to submit an abstract/paper to the 2012 IEEE 18^thInternational Symposium for Design and Technology in Electronic Packaging (SIITME). The scientific event will take place in Alba Iulia, the famous historical town of Transylvania, located in the very middle of Romania, on October 25^th–28^th, 2012. Web page: https://www.siitme.ro

SUBMISSION OF ABSTRACTS AND PAPERS:

Interested authors are invited to submit a two-page abstract according to the template, as MS-Word document, Version 97 or later, and as PDF document, attached to an e-mail to siitme@siitme.ro.

Papers meeting the quality criteria will be included in the IEEE Xplore Digital Library.
Abstracts and papers will be reviewed by the international Scientific Committee.

1.  Each abstract will be reviewed on:
– suitability for one of the topics of the conference
– scientific content and level, and the relevance of presented results;
– correspondence with the abstract template, English usage and grammar.

Authors of accepted abstracts will be invited to submit a full-length conference paper according to the conference paper template.

2.  Papers meeting the following criteria will be published in the Conference Proceedings and will be available through IEEE Xplore:
– the comments of the reviewers have been taken into consideration;
– originality of the paper[1] is given;
– it corresponds with the paper template, English usage and grammar are correct,
– signed IEEE copyright form has been submitted.

TOPICS
A. Emerging Technologies & Trends in Advanced Packaging
B. Power Electronics and Microsystems Packaging
C. Assembly and Manufacturing Technology
D. Electrical Design, Simulation & Modelling
E. Optoelectronics & Advanced Communication Packaging
F. Applied Reliability
G. Challenge in Global Education

CHAIRS:

IMPORTANT DATES:

Download the Call for Papers – SIITME2012  (PDF format)