The organising committee of SIITME 2020 kindly invites you to submit an abstract/paper to the 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME). The scientific event will take place in Pitesti, on October 21st–24th, 2020.
SUBMISSION OF ABSTRACTS AND PAPERS
Papers meeting the quality criteria will be included in the IEEE Xplore Digital Library and Thomson-Reuters ISI-CPCI.
Abstracts and papers will be reviewed by the international Scientific Committee.
1. Each abstract will be reviewed on:
– suitability for one of the topics of the conference
– scientific content and level, and the relevance of presented results;
– correspondence with the abstract template, English usage and grammar.
Authors of accepted abstracts will be invited to submit a full-length conference paper according to the conference paper template.
2. Papers meeting the following criteria will be published in the Conference Proceedings and will be available through IEEE Xplore:
– the comments of the reviewers have been taken into consideration;
– originality of the paper is given;
– it corresponds with the paper template, English usage and grammar are correct,
– signed IEEE copyright form has been submitted.
A. Emerging Topics in Advanced Packaging;
B. New Components and Manufacturing Technologies;
C. Printed Electronics, Smart Textiles and Healthcare;
D. Sensors, Actuators and Microsystems;
E. Nanomaterials, Nanoelectronics and Nanotechnology;
F. Embedded Systems, Robotics and Artificial Intelligence;
G. Power Electronics and Thermal Management;
H. Smart Grid and Renewable Energy;
I. Virtual Prototyping and System Validation;
J. Quality Management, Applied Reliability, Characterization and Testing Failure Diagnosis;
K. Corrosion in Electronics;
L. Challenges in Digitalisation and Global Education for Electronics.
|Submission of abstracts :||31st of May 2020|
|Notification of abstract acceptance:||30th of June 2020|
|Submission of camera-ready papers and copyright forms:||6th of September 2020|
|Authors registration deadline:||20th of September 2020|
|Participants registration deadline:||10th of October 2020|
Paul SVASTA, “Politehnica” University of Bucharest, Romania
General Academic Co-Chair:
Dan PITICĂ, Technical University of Cluj-Napoca, Romania
General Industrial Co-Chair:
TBD, TBD, Romania
TBD, University of Pitesti, Romania
Cosmin MOISA, Continental Automotive, Timisoara, Romania
Technical Program Chair:
Detlef BONFERT, Fraunhofer EMFT, Münich, Germany
Technical Program Co-Chair:
Norocel CODREANU, “Politehnica” University of Bucharest, Romania
Awards Committee Chair:
Heinz WOHLRABE, Dresden University of Technology, Dresden, Germany
Scientific Committee Chair:
Balázs ILLÉS, Budapest University of Technology and Economics, Hungary
Heinz WOHLRABE, Dresden University of Technology, Germany
Ciprian IONESCU, “Politehnica” University of Bucharest, Romania
Promotion & Advertising Committee Chair:
Alexandra FODOR, Technical University of Cluj- Napoca, Romania
Human Resource Education and Training Committee Chair:
Aurelia FLOREA, MIELE Tehnica, Braşov, Romania
Gabriel CHINDRIŞ, Technical University of Cluj- Napoca, Romania
Bogdan MIHĂILESCU, “Politehnica” University of Bucharest, Romania
International Publication Advisor:
Zsolt ILLYEFALVI-VITÉZ, Budapest University of Technology and Economics, Hungary
The conference fee includes the opening ceremony and welcome reception, full access to all technical (oral and poster) sessions, exhibition area, all meals (breakfasts, coffee breaks, lunches and dinners), three nights accommodation, printed abstracts proceedings, conference proceedings on memory stick, conference kit (conference bag, badge, booklet, pen, and other related objects), and participation to the cultural programme.
|Registration Officer||Delia Lepădatu
Tel: 0040 213169633 / 0040 214024638
Fax: 0040 213169634
Splaiul Independentei 313
06042, Bucharest, Romania
 The originality of papers will be checked by the iThenticate plagiarism detection and prevention software.