Loading... (0%)
SIITME 2017

Authors’ area


The organising committee of SIITME 2017 kindly invites you to submit an abstract/paper to the 2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME). The scientific event will take place in Constanta, Romania on October 26th–29th, 2017.



Submission of abstracts/papers

Authors are invited to submit an abstract/paper to SIITME 2016 using the conference management system powered by Microsoft’s Academic Conference Management Service.

SIITME is an IEEE Conference. Papers meeting quality criteria are indexed IEEE Xplore Digital Library and Thomson-Reuters ISI-CPCI.




PARTNERS

partners_siitme2016

SPONSORS

sponsors_siitme_2016
SIITME History

The International Symposium was founded in 1995 and each year the event takes place in a different location.

Award Winners over the years

Over the last decade the Scientific Committee of SIITME has granted several awards to international scientists based upon their contribution and presentation at the symposium.

2015 Conference Program

The Conference Program brochure is available for download.