THE ELECTRONIC WEEK OF ELECTRONICS PACKAGING COMMUNITY 2021 ONLINE, 25th-30thOCTOBER 2021
2 EVENTS: TIE (TIEplus)& IEEE SYMPOSIUM SIITME
The SIITME 2020 Steering Committee has, in agreement with IEEE and IEEE Hungary &Romania EPS&NTC Joint Chapter, decided to run SIITME 2020 as a virtual, liveconference on the CISCO Webex platform on the dates originally scheduled (21-24 October 2020).
This will ensure a high-quality conference to be held independent of what restrictions may apply in October 2020. The live format will allow interaction similar to an in-person conference. The digital format will give new possibilities, such as recording of presentations allowing to catch up presentations in parallel sessions.
Organizing details concerning the virtual, live format will be communicated in advance before the conference, along with the digital requirements of the interactive plenary and poster sessions.
The organising committee of SIITME 2020 kindly invites you to submit an abstract/paper to the 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME).
The scientific and technical event event will take place on October 21st–24th, 2020 as an ONLINE / LIVE virtual conference on the CISCO Webex platform.
Submission of abstracts [EXTENDED]: 15th of July 2020
Notification of abstract acceptance [EXTENDED]: 10th of August 2020
Submission of camera-ready papers: 10th of October 2020
Authors registration deadline: 10th of October 2020
Participants registration deadline: 10th of October 2020All submissions are going through the established process of evaluation, presentation and publication following the IEEE regulations.
Authors are invited to submit an abstract/paper to SIITME 2020 using the conference management system powered by Microsoft’s Academic Conference Management Service.