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Call for Papers

The organising committee of SIITME 2014 kindly invites you to submit an abstract/paper to the 2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging (SIITME). The scientific event will take place in Bucharest, on October 23rd–26th, 2014.

Download the Call for Papers – SIITME2014 (PDF)

Conference Committees

Conference Registration and Fees

Exhibition Registration and Fees
Location and venue (maps and general orientation)

The conference and exhibition will take place at: Central Library of “Politehnica” University of Bucharest, Rectorate Campus, Bucharest, Romania

SIITME 2014 Venue

SIITME 2014 Venue

The accomodation is at: Hotel Yesterday, Economu Cezărescu 8 Bucharest, Romania


Conference Programme (Brochure)

Submission of abstracts/papers

Authors are invited to submit an abstract/paper to SIITME 2014 using the conference management system powered by Microsoft’s Academic Conference Management Service.

Author Login page

New Author Sign Up page

SIITME2013 Photo Gallery

Open Gallery
Award Winners

Based upon their contribution and presentation at the conference, the Scientific Committee of SIITME 2013 is pleased to announce this edition’s award winners.

Award Winners over the years

Over the last decade the Scientific Committee of SIITME has granted several awards to international scientists based upon their contribution and presentation at the symposium.

2013 Conference Program

The Conference Program brochure is available for download.