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SIITME 2016 Conference and Exhibition

Authors’ area


The organising committee of SIITME 2016 kindly invites you to submit an abstract/paper to the 2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging (SIITME). The scientific event will take place in Baile Felix, Oradea, Romania on October 20th–23rd, 2016.




Submission of abstracts/papers

Authors are invited to submit an abstract/paper to SIITME 2016 using the conference management system powered by Microsoft’s Academic Conference Management Service.




Tuturor celor prezenți la SIITME 2015, invitați, participanţi precum şi expozanți le aducem mulțumiri pentru contribuția lor valoroasă la buna reușită a prezentei ediții.
Le adresăm de asemenea mulțumiri keynote speakers precum şi organizatorilor prezentului eveniment.

We would like to thank all those that were present at SIITME 2015: speakers, attendees, and exhibitors, for their valuable contribution to the smooth running of this edition.
We would also like to thank our keynote speakers, as well as the organizers of this event.

General Chair: Paul SVASTA, “Politehnica” University of Bucharest, Romania
General Co-Chair: Dan PITICĂ, Technical University of Cluj-Napoca, Romania


SIITME History

SIITME 2015

Based upon their contribution and presentation at the conference, the Scientific Committee of SIITME 2015 is pleased to announce this edition’s award winners.


Award Winners SIITME 2015

Conference Venue

Advanced Programme Brochure

Conference Committees
SIITME History

The International Symposium was founded in 1995 and each year the event takes place in a different location.

Award Winners over the years

Over the last decade the Scientific Committee of SIITME has granted several awards to international scientists based upon their contribution and presentation at the symposium.

2015 Conference Program

The Conference Program brochure is available for download.