The organising committee of SIITME 2018 kindly invites you to submit an abstract/paper to the 2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging (SIITME). The scientific and technical event event will take place in Iași, Romania on October 25th–28th, 2018.
Authors are invited to submit an abstract/paper to SIITME 2018 using the conference management system powered by Microsoft’s Academic Conference Management Service.
SIITME is an IEEE Conference. Papers meeting quality criteria are indexed IEEE Xplore Digital Library and Thomson-Reuters ISI-CPCI.
Over the last decade the Scientific Committee of SIITME has granted several awards to international scientists based upon their contribution and presentation at the symposium.