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SIITME 2015 Conference and Exhibition

Authors’ area

Call for Papers - SIITME 2015

The organising committee of SIITME 2015 kindly invites you to submit an abstract/paper to the 2015 IEEE 21th International Symposium for Design and Technology in Electronic Packaging (SIITME). The scientific event will take place in Brasov, on October 22rd–25th, 2015.

Preliminary Program

Conference Registration Exhibition Registration

Conference Committees

Submission of abstracts/papers

Authors are invited to submit an abstract/paper to SIITME 2015 using the conference management system powered by Microsoft’s Academic Conference Management Service.

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SIITME 2015 Paper Template

Abstract registration system has been closed

We thank all authors who sent us their paper abstract.
Please use the above SIITME 2015 Paper template for you full paper registration for accepted abstracts.

SIITME History

The International Symposium was founded in 1995 and each year the event takes place in a different location.

Award Winners over the years

Over the last decade the Scientific Committee of SIITME has granted several awards to international scientists based upon their contribution and presentation at the symposium.

2014 Conference Program

The Conference Program brochure is available for download.