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Authors’ area

The organising committee of SIITME 2017 kindly invites you to submit an abstract/paper to the 2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME). The scientific and technical event event will take place in Constanta, Romania on October 26th–29th, 2017.

Submission of abstracts/papers

Authors are invited to submit an abstract/paper to SIITME 2017 using the conference management system powered by Microsoft’s Academic Conference Management Service.

SIITME is an IEEE Conference. Papers meeting quality criteria are indexed IEEE Xplore Digital Library and Thomson-Reuters ISI-CPCI.

Authors are kindly asked to check that they have uploaded their IEEE Copyright forms to CMT System.
We thank all authors who contributed to SIITME 2017.
We also thank to the reviewers who made an effort to evaluate the extensive number of abstracts received at this edition of SIITME 2017.

PARTNERS

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SPONSORS

EXHIBITORS

Deery Brook
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SIITME2016 Photo Gallery

SIITME History

The International Symposium was founded in 1995 and each year the event takes place in a different location.

Award Winners over the years

Over the last decade the Scientific Committee of SIITME has granted several awards to international scientists based upon their contribution and presentation at the symposium.

2016 Conference Program

The Conference Program brochure is available for download.