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General Information

The organising committee of SIITME 2019 kindly invites you to submit an abstract/paper to the 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME). The scientific and technical event event will take place in Cluj-Napoca, Romania on October 23rd–26th, 2019.

Authors Area

Authors are invited to submit an abstract/paper to SIITME 2019 using the conference management system powered by Microsoft’s Academic Conference Management Service.

SIITME is an IEEE Conference. Papers meeting quality criteria are indexed IEEE Xplore Digital Library and Thomson-Reuters ISI-CPCI.




SIITME2018 Photo Gallery

SIITME History

The International Symposium was founded in 1995 and each year the event takes place in a different location.

Award Winners over the years

Over the last decade the Scientific Committee of SIITME has granted several awards to international scientists based upon their contribution and presentation at the symposium.

2018 Conference Program

The Conference Program brochure is available for download.