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SIITME 2015 Conference and Exhibition

Authors’ area

Call for Papers - SIITME 2015

The organising committee of SIITME 2015 kindly invites you to submit an abstract/paper to the 2015 IEEE 21th International Symposium for Design and Technology in Electronic Packaging (SIITME). The scientific event will take place in Brasov, on October 22rd–25th, 2015.

SIITME 2015 Abstract Template

Conference Committees

Submission of abstracts/papers

Authors are invited to submit an abstract/paper to SIITME 2015 using the conference management system powered by Microsoft’s Academic Conference Management Service.

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SIITME2014 Photo Gallery

Open Gallery

Tuturor celor prezenți la SIITME 2014, invitați, participanţi precum şi expozanți le aducem mulțumiri pentru contribuția lor valoroasă la buna reușită a prezentei ediții.
Le adresăm de asemenea mulțumiri keynote speakers precum şi organizatorilor prezentului eveniment.

We would like to thank all those that were present at SIITME 2014: speakers, attendees, and exhibitors, for their valuable contribution to the smooth running of this edition.
We would also like to thank our keynote speakers, as well as the organizers of this event.

General Chair: Paul SVASTA, “Politehnica” University of Bucharest, Romania
General Co-Chair: Dan PITICĂ, Technical University of Cluj-Napoca, Romania

SIITME History
Award Winners SIITME 2014

Based upon their contribution and presentation at the conference, the Scientific Committee of SIITME 2014 is pleased to announce this edition’s award winners.

Keynote Speakers and Presentations

Conference Programme (Brochure)

Conference Committees
SIITME History

The International Symposium was founded in 1995 and each year the event takes place in a different location.

Award Winners over the years

Over the last decade the Scientific Committee of SIITME has granted several awards to international scientists based upon their contribution and presentation at the symposium.

2014 Conference Program

The Conference Program brochure is available for download.