SIITME 2009

The 15th International Symposium for Design and Technology of Electronics Packages will take place in Gyula, a beautiful town near the eastern border of Hungary, 17-20th Sep 2009.
The Primary objective of the Symposium is to provide an international forum for dissemination of information and scientific results relating to education, research and development activities. It is a tradition for all participants of the seminar to present paper(s) which are published in the proceedings.

SIITME is a premier European forum for the exchange of information between senior and young scientists from academic communities and electronic industries on topics related to their experimental and theoretical work in the very wide field of electronics and microelectronics technology and packaging.
Based on a unique combination of oral and poster presentations as well as individual meetings, researchers can come together to discuss scientific problems and organize international cooperation in a convenient atmosphere during three conference days.

SIITME 2009 CONFERENCE COMMITTEE

General Chair:
Paul SVASTA, CETTI, UPB, Bucharest, România
General Co Chair:
Dan PITICA, Technical University of Cluj-Napoca, România
Conference Chair:
Zsolt ILLYEFALVI-VITÉZ, BME, Budapest, Hungary
Conference Program Chair
Andrei DRUMEA , "Politehnica" University of Bucharest, România
Scientific Chair:
Vlad CEHAN, „Gheorghe Asachi” Technical University of Iasi, România
Heinz WOHLRABE, Dresden University of Technology, Germany

CONFERENCE VENUE
Map of Gyula
The SIITME 2009 conference will be organized in the Town Hall of Gyula (www.gyula.hu).
The accommodation venues will be in Halászcsárda Panzió (www.halaszcsarda-panzio.hu) and in
D-Hotel (www.d-hotel.hu)

Organizers:
Budapest University of Technology and Economics
Department of Electronics Technology
H-1111 Budapest, Goldman t 3.
www.ett.bme.hu

"Politehnica" University of Bucharest
Technological Electronics and Interconnections Techniques Research Center, UPB-CETTI.
www.cetti.ro

Co-sponsored by:
IEEE-CPMT – Components, Packaging and ManufacturingTechnology Society
Hungarian-Romanian Joint Chapter
www.cpmt.org

IEEE - Romania
www.ieee.ro

National Authority for Scientific Research
www.mct.ro