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SIITME 2020  Keynote Speakers

(in alphabetic order)

Keynote speaker:

Prof. Christopher Bailey Ph.D.
President of the IEEE Electronics Packaging Society

University of Greenwich UK

C.Bailey@greenwich.ac.uk

Presentation:
”Design Challenges for Advanced Packaging of Electronic Systems”

Chris Bailey is President of the IEEE Electronics Packaging Society and Director of the Computational Mechanics and Reliability Group at the University of Greenwich, UK. He has a PhD in Computational Modelling and an MBA in Technology Management. He has published over 300 papers on the topic of Design, Modelling and Simulation of Electronics Packaging. Chris has served on several external government committees, which includes the 2014 UK Research Excellence Framework, to assess research outputs and research impact across UK universities.

Keynote speaker:

Istvan Novak
Principal Signal and Power Integrity Engineer

Samtec

istvan.novak@verizon.net

Presentation:
“Power Integrity Challenges, Trends and Promises”

Istvan Novak is a Principal Signal and Power Integrity Engineer at Samtec, working on advanced signal and power integrity designs. Prior to 2018 he was a Distinguished Engineer at SUN Microsystems, later Oracle. He worked on new technology development, advanced power distribution, and signal integrity design and validation methodologies for SUN’s successful workgroup server families

Keynote speaker:

Vladimír Sítko
Managing Director

PBT Works s.r.o

V.Sitko@pbt-works.com

Presentation:
“How to fulfill reliability demands for future electronic assemblies”

Vladimír Sítko is a founder and managing director of PBT Works s.r.o, a recognized manufacturer of cleaning systems for electronic assemblies, stencil, and microelectronic applications.

He was starting his career in the microelectronics industry as a developer of the mechanical and physical measuring instrument and production machines for prototyping for chip process, assembly, and encapsulation. Later he was engaged as a process project engineer for vacuum electronic component production.

Keynote speaker:

Vesa Vuorinen
Senior University Lecturer

School of Electrical Engineering, Aalto University

Vesa.Vuorinen@aalto.fi

Presentation:
“Wafer-Level Metal Bonding for MEMS/MOEMS devices”

Dr. Vesa Vuorinen received his M.Sc. degree 1995 in Materials Science and Engineering and D.Sc. (Tech.) degree in 2006 in the Department of Electronics from the former Helsinki University of Technology. During the last decade, his research has been focusing on materials compatibility in heterogeneous systems with the emphasis on interfacial phenomena. He has also been responsible for teaching physics of failure and reliability assessment in electronics and direct research cooperation with the industrial partners for the last twenty years.

Keynote speaker:

Heinz Wohlrabe, PhD, Dr.habil
Professor

Dresden University of Technology

heinz.wohlrabe@tu-dresden.de

Presentation:
“Quality and Reliability Influences of SMD-Devices due to Warpage Behavior of SMD-Packages and Boards during Soldering”

Dr.-Ing. habil. Heinz Wohlrabe (born 1955) studied 1974-1978 electro techniques at Technische Universität Dresden (Dresden University of Technology). He has got the PHD in 1984 at the same university. The main important topic was the usage of statistical quality control in electronics technology. The focus of his scientific work over all this time was the application of mathematical-statistical methods (namely statistical process control, machine and process capability analysis, Design of Experiments) for the quality assurance in electronic production processes.

Keynote speaker:

Klaus-Juergen Wolter
Senior Professor

TU Dresden

klaus-juergen.wolter@tu-dresden.de

Presentation:
“Robust electronics for automotive applications including autonomous driving”

Prof. Klaus Wolter’s research interests have embraced many aspects of microelectronics packaging, including substrate technologies, assembly technologies, photonic packaging, MEMS, joining technologies, reliability of electronic packages, and non-destructive test methods. He is well known as co-author of six textbooks, co-editor of three book series with a total of 39 books, author and co-author of more than 200 papers. He is a senior member of IEEE-EPS.

PDC in DLP as keynote talk

Keynote speaker:

Markondeya Pulugurtha Raj
Associate Professor

Florida International University

mpulugur@fiu.edu

Presentation:
“Heterogeneous System Component Integration with Nanopackaging”

Dr. P. M. Raj‘s expertise is in packaging of electronic and bioelectronic systems, with emphasis on nanoscale RF, power and bioelectronic components, and  active and passive integration in ultrathin embedded modules. He is an Associate Professor in Biomedical Engineering and Electrical and Computer Engineering at Florida International University, and Adjunct Professor at Georgia Institute of Technology, Atlanta. His research led to 330 publications, which include 8 patents. He received more than 25 best-paper awards.

Keynote speaker:

Qing Zhang
Professor

School of EEE, Nanyang Tech Univeersity, Singapore

 

eqzhang@ntu.edu.sg

Presentation:
“Electric Generators Based on Semiconductor Junctions”

Qing Zhang is a Professor at Centre of Micro-/Nano-electronics, School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore. His main research interests cover the electronic properties and applications of carbon based materials and other low dimensional electronic materials, energy storage devices and energy harvesting devices, etc.

PDC Courses

Keynote speaker:

Istvan Novak
Principal Signal and Power Integrity Engineer

Samtec

istvan.novak@verizon.net

Presentation:
“Selected Tips for Making Successful Power Distribution Designs”

This course will highlight four important power-integrity topics in 45-minute sessions.

In the first module we will discuss the distribution of DC power. The second module will discuss the large and sometimes surprisingly unexpected loss of capacitance in some multi-layer ceramic capacitor (MLCC) applications. Based on the learnings from the first two topics, the third block will explore power distribution filters, power distribution networks with a series inductor or ferrite bead. The fourth module will focus on the scattering parameters of bypass capacitors.