Business Development Manager
Texas Instrument, Inc.
”High Performance Analog”
Soufiane has held several roles in the semiconductor industry, ranging from senior applications engineers to product definition and business development.
He has worked closely with analog and digital designers to define world class products which have become industry standards.
Traian Cornel Cucu
Global Applications and Technologies Expert Group Director
Alpha Assembly Solutions, USA
”Low Temperature Solder Alloys’s influence on Solder Joint Reliability”
Traian Cucu is presently leading the Global Applications and Technologies Expert Group at Alpha Assembly Solutions. He was assigned to oversee the new applications and technologies developments which are part of the full solutions offering for the SMT and die attach markets. He was part of the technical team from Cookson Electronics that was implementing tin-lead SMT process in late 1990s during the transition from THT to SMT. Early 2000s he was involved in the development and implementation of the lead-free technology for both wave and SMT processes, working for Cookson Electronics and Brady. He was working with major mobile phone OEMs in order to implement new processes that will enable a quicker transition to finer pitch designs and 3D assembly systems for the next generation devices.
Senior Analog Applications Engineer
The University of Michigan
The University of Arizona
Texas Instrument, Inc.
”A Long-term Stability of IC Parameters and the Temperature Acceleration Factor”
Marek Lis is a Senior Analog Applications Engineer on Precision Analog (PA) High Performance Linear team at Texas Instruments – Tucson Design Center. Prior to its acquisition by Texas Instruments in 2001, he had worked for 10 years at Burr-Brown Corporation as an analog IC design engineer introducing over twenty new products including JFET and CMOS op amps and LDO’s. Afterwards, he held for eight years a design manager position in charge of development of series/shunt voltage references as well as instrumentation amplifiers and op amps.
Dr. Ephraim Suhir
Portland State University, Portland, OR, USA ,
Bell Laboratories, Physical Sciences and Engineering Research Division, Murray Hill, NJ (ret),
Technical University, Vienna, Austria, and
ERS Co. , 727 Alvina Ct., Los Altos, CA
”Solder Joint Interconnections in Automotive Electronics: Design-for-Reliability and Accelerated Testing”
Dr. Suhir is Life Fellow of IEEE; Fellow of the American Society of Mechanical Engineers (ASME), American Physical Society (APS), Institute of Physics (UK), Society of Optical Engineers (SPIE), International Microelectronics and Packaging Society (IMAPS), the Society of Plastics Engineers (SPE); Associate Fellow of the American Institute of Aeronautic and Astronautic (AIAA); and Foreign Full Member (Academician) of the National Academy of Engineering, Ukraine, the country where he was born.
TU Dresden ZmP (Centre of Microtechnical Production)
”Reliability of Solder Joints – Determination, Statistical Analysis and Dependencies to other Characteristics”
Dr.-Ing. habil. Heinz Wohlrabe (born 1955) studied 1974-1978 elektro techniques at Technische Universität Dresden (Dresden University of Technology). He got his PHD in 1984 at the same university. The main important topic were the usage of statistical quality control in electronics technology. The main focus of his scientific work over alll this time was the usage of mathematical-statistical methodes (namely statistical process control, machine and process capability analysis, Design of Experiments) for the quality assurance in electronic production processes
Director of Product Development Center
”Updates in highly automated driving – key components for driver-vehicle interaction”
Dirk Zittlau is globally managing the Product Development Center Interior Camera Products within the Business Unit Interior Instrumentation and Driver Human Machine. He is active since more than 20 years in the Automotive Research and Development, for both advanced development and direct OEM serial project developments. The development activities had focus on active safety systems, included: vision processing applications, information and comfort instrumentation including graphical processing products.