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2017 IEEE 23rd Edition

Call for Papers - SIITME 2017

The organising committee of SIITME 2017 kindly invites you to submit an abstract/paper to the 2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME). The scientific event will take place in Constanta, on October 26th–29th, 2017.

Conference Committees