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Dear Colleagues,

The organising committee of SIITME 2014 kindly invites you to submit an abstract/paper to the 2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging (SIITME). The scientific event will take place in Bucharest, on October 23rd–26th, 2014. Web page: http://www.siitme.ro


Interested authors are invited to submit a two-page abstract according to the template, as MS-Word document, Version 97 or later, and as PDF document, using the SIITME Conference Management System.

Papers meeting the quality criteria will be included in the IEEE Xplore Digital Library.
Abstracts and papers will be reviewed by the international Scientific Committee.

1.  Each abstract will be reviewed on:
– suitability for one of the topics of the conference
– scientific content and level, and the relevance of presented results;
– correspondence with the abstract template, English usage and grammar.

Authors of accepted abstracts will be invited to submit a full-length conference paper according to the conference paper template.
2.  Papers meeting the following criteria will be published in the Conference Proceedings and will be available through IEEE Xplore:
– the comments of the reviewers have been taken into consideration;
– originality of the paper[1] is given;
– it corresponds with the paper template, English usage and grammar are correct,
– signed IEEE copyright form has been submitted.


A. Emerging Technologies & Trends in Advanced Packaging, Printed Electronics
B. Power Electronics and Microsystems Packaging
C. Assembly and Manufacturing Technology
D. Design of Electronic Circuits and Systems
E. Electronics Simulation & Modelling
F. Electronics Applications and Automotive Electronics
G. Optoelectronics & Advanced Communication Packaging
H. Applied Reliability
I. Challenge in Global Education


Submission of abstracts (extended): September 14th, 2014
Notification of abstract acceptance: September 28st, 2014
Submission of camera-ready papers and copyright forms: October 12th, 2014
Registration deadline: October 15th, 2014


General Chair: Paul SVASTA, “Politehnica” University of Bucharest, RO
General Co-Chair: Dan PITICĂ, Technical University of Cluj-Napoca, RO
Conference Chair: Norocel CODREANU, “Politehnica” University of Bucharest, RO
Conference Co-Chair: Ciprian IONESCU, “Politehnica” University of Bucharest, RO
Technical Program Committee Chair: Detlef BONFERT, Fraunhofer EMFT in Munich, DE
Awards Committee Chair:  Heinz WOHLRABE, Technical University of Dresden, DE
Publication Committee Chair: Zsolt ILLYEFALVI-VITÉZBudapestUniversity of Technology and Economics, HU


The conference fee includes the opening ceremony and welcome reception, full access to all technical (oral and poster) sessions, exhibition area, all meals (breakfasts, coffee breaks, lunches and dinners), three nights accommodation, printed abstracts proceedings, conference proceedings on memory stick, conference kit (conference bag, badge, booklet, pen, and other related objects), and participation to the cultural programme.

The conference will take place at:
Hotel Yesterday
Economu Cezărescu 8
Bucharest, Romania


Registration Officer Delia Lepădatu
Travel Advisor Norocel Codreanu
0040 21 3169633
Multimedia Bogdan Mihăilescu

Tel:       0040 213169633 / 0040 214024638
Fax:      0040 213169634
E-mail:    siitme@siitme.ro

Correspondence address:
Splaiul Independentei 313
06042, Bucharest, Romania

Download the Call for Papers – SIITME2014  (PDF format)

[1] The originality of papers will be checked by the iThenticate plagiarism detection and prevention software.